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학술저널
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한국전기전자재료학회 Transactions on Electrical and Electronic Materials Transactions on Electrical and Electronic Materials 제10권 제4호
발행연도
2009.1
수록면
131 - 134 (4page)

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The electrical properties and the microstructure of nitrogen-doped poly 3C-SiC films used for micro thermal sensors were studied according to different thicknesses. Poly 3C-SiC films were deposited by LPCVD (low pressure chemical vapor deposition) at 900oC with a pressure of 4 torr using SiH2Cl2 (100%, 35 sccm) and C2H2 (5% in H2, 180 sccm) as the Si and C precursors, and NH3 (5% in H2, 64 sccm) as the dopant source gas. The resistivity of the poly SiC films with a 1,530 Å thickness was 32.7 Ω-cm and decreased to 0.0129 Ω-cm at 16,963 Å. The measurement of the resistance variations at different thicknesses were carried out within the 25oC to 350oC temperature range. While the size of the resistance variation decreased when the films thickness increased, the linearity of the resistance variation improved. Micro heaters and RTD sensors were fabricated on a Si3N4 membrane by using poly 3C-SiC with a 1um thickness using a surface MEMS process. The heating temperature of the SiC micro heater, fabricated on 250 ㎛ⅹ250 ㎛ Si3N4 membrane was 410oC at an 80 mW input power. These 3C-SiC heaters and RTD sensors, fabricated by surface MEMS, have a low power consumption and deliver a good long term stability for the various thermal sensors requiring thermal stability.

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