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A photoluminescence (PL) imaging method using a vision camera was employed to inspect InGaN/GaNquantum-well light-emitting diode (LED) epi-wafers. The PL image revealed dark spot defective regions(DSDRs) as well as a spatial map of integrated PL intensity of the epi-wafer. The Shockley-Read-Hall(SRH) nonradiative recombination coefficient increased with the size of the DSDRs. The high nonradiativerecombination rates of the DSDRs resulted in degradation of the optical properties of the LED chipsfabricated at the defective regions. Abnormal current-voltage characteristics with large forward leakageswere also observed for LED chips with DSDRs, which could be due to parallel resistances bypassing thejunction and/or tunneling through defects in the active region. It was found that the SRH nonradiativerecombination process was dominant in the voltage range where the forward leakage by tunneling wasobserved. The results indicated that the DSDRs observed by PL imaging of LED epi-wafers were highdensity SRH nonradiative recombination centers which could affect the optical and electrical propertiesof the LED chips, and PL imaging can be an inspection method for evaluation of the epi-wafers andestimation of properties of the LED chips before fabrication

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