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자료유형
학술저널
저자정보
Fengjiang Wang (Jiangsu University of Science and Technology)
저널정보
대한금속·재료학회 Electronic Materials Letters Electronic Materials Letters Vol.15 No.1
발행연도
2019.1
수록면
36 - 48 (13page)

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The interfacial behaviors of Cu/molten Sn–58Bi/Cu solder joints under the coupling eff ect of a temperature gradient and thecurrent stressing have been investigated. The most obvious change of the interfacial behaviors under the individual electromigration(EM) and thermomigration (TM) in molten solder was the asymmetrical growth of interfacial Cu–Sn intermetalliccompounds (IMCs), which grew rapidly as the stressing time prolonged. The growth rates of the interfacial IMCs inducedby TM under a temperature gradient of 40 °C/cm were slightly faster than EM under the current density of 0.5 × 10 4 A/cm 2 . However, the microstructure evolution and interfacial behaviors changed obviously when the thermal was distributedunevenly across the entire solder stripe under current stressing. It was found that there was a Bi-rich layer adhered to theanode side and a distributed Cu 6 Sn 5 phase existed in the solder matrix when the anode and the cold end were at the sameend. Additionally, a large number of Bi-blocks and Cu–Sn IMCs were dramatically observed in the solder matrix when theanode and the hot end were on the same side. The main reason for this result may be attributed to the signifi cant change ofthe diff usion of Bi atoms under the thermo-electric coupling conditions. In the initial melting stage of solder, the Bi atomsin molten Sn–58Bi solder rapidly diff used to the anode and then began to be reversely dissolved into the solder matrix. Theexperimental results proved the additional temperature gradient played a positive or negative role on the reverse dissolutionof Bi atoms in the heat preservation process.

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