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자료유형
학술저널
저자정보
S. Jayesh (Cochin University of Science and Technology) Jacob Elias (Cochin University of Science and Technology)
저널정보
대한금속·재료학회 Metals and Materials International Metals and Materials International Vol.26 No.1
발행연도
2020.1
수록면
107 - 114 (8page)

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Lead cannot be used in the solder material anymore due to environmental legislations which is related to the inherent toxicityof lead. This paper investigates the effect of silver (Ag) addition on the melting behavior, microstructure, and microhardnessof Ternary lead free solder alloy Sn–0.5Cu–3Bi. The contact angle between Sn–0.5Cu–3Bi and Cu-substrate were alsoanalyzed. Samples with different Ag percentages (0, 0.25, 0.5, 0.75 and 1.0 wt%) in Sn–0.5Cu–3Bi were prepared using aninduction furnace, annealing furnace with argon gas. Tests were conducted for melting temperature using TG–DTA analysis,chemical composition using ICP–OES, Hardness using Vickers’s hardness tester and the microstructure using Field emissionscanning electron microscopy. The obtained results were thoroughly analyzed. The results show that the Ag addition hasstriking positive effects on enhancing the properties of the base solder alloy. Melting point is found to be decreasing withthe increase in Ag content. Hardness and contact angle were improved with the addition of Ag. The microstructure observationsrevealed that the Ag was uniformly distributed on the surface of the solder matrix. The recommended content of theAg to be added into the Sn–0.5Cu–3Bi solder alloy is 1.0 wt%. With the observed better properties it can be considered asthe potential alternative to lead–tin alloy.

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