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논문 기본 정보

자료유형
학술저널
저자정보
정준기 (강릉원주대학교) 하태권 (강릉원주대학교)
저널정보
한국소성·가공학회 소성·가공 소성가공 제28권 제1호(통권 제179호)
발행연도
2019.2
수록면
43 - 48 (6page)

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Aluminum nitride (AlN) is used by the semiconductor industry, and is a compound that is required when manufacturing high thermal conductivity. The AlN films with c-axis orientation and thermal conductivity characteristic were deposited by using the Pulsed Laser Deposition (PLD). The AlN thin films were characterized by changing the deposition conditions. In particular, we have researched the AlN thin film deposited under optimal conditions for growth atmosphere. The epitaxial AlN films were grown on sapphire (c-Al₂O₃) single crystals by PLD with AlN target. The AlN films were deposited at a fixed temperature of 650 °C, while conditions of nitrogen (N₂) pressure were varied between 0.1 mTorr and 10 mTorr. The quality of the AlN films was found to depend strongly on the N₂ partial pressure that was exerted during deposition. The Xray diffraction studies revealed that the integrated intensity of the AlN (002) peak increases as a function the corresponding Full width at half maximum (FWHM) values decreases with lowering of the nitrogen partial pressure. We found that highly c-axis orientated AlN films can be deposited at a substrate temperature of 650 °C and a base pressure of 2×10<SUP>-7</SUP> Torr in the N₂ partial pressure of 0.1 mTorr. Also, it is noted that as the N₂ partial pressure decreased, the thermal conductivity increased.

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Abstract
1. 서론
2. 실험 방법
3. 결과 및 토의
4. 결론
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UCI(KEPA) : I410-ECN-0101-2019-551-000442941