Effect of AlN content on the properties and microstructure of pressureless-sintered Al2O3-AlN composites

Jilin Hu; Qizhong Huang; Hongxia Peng; Xiuying Tian; Zhanjun Chen; Yangxi Peng

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자료유형: 학술저널

저자정보: Jilin Hu (Central South University) Qizhong Huang (Central South University) Hongxia Peng (Central South University) Xiuying Tian (Hunan University of Humanities Science and Techno) Zhanjun Chen (Hunan University of Humanities Science and Techno) Yangxi Peng (Hunan University of Humanities Science and Techno)

저널정보: 한양대학교 세라믹공정연구센터 Journal of Ceramic Processing Research Journal of Ceramic Processing Research 제19권 제3호

발행연도: 2018.6

수록면: 224 - 230 (7page)

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Aluminium oxide (Al2O3)-aluminium nitride (AlN) composites were prepared at 1500-1600 oC by pressureless sintering. Themain raw materials used were AlN and Al2O3, and appropriate amounts of TiO2-Y2O3-CaO-La2O3 quaternary sintering aidswere added. The effects of different AlN contents and sintering temperatures on the bulk density, bending strength, Rockwellhardness, thermal conductivity, and other properties of Al2O3-based ceramics were studied. The phase composition andmicrostructure of the samples were analysed with an X-ray diffractometer and scanning electron microscope. Results showedthat the Al2O3-AlN composites had excellent overall performance in terms of a flexural strength of 295.7MPa, a Rockwellhardness of 61.5 HRA, and a thermal conductivity of 38.8W/(m·K) (at 25 oC) after pressureless sintering at 1600 oC for 3 hwith 10 wt% AlN content. These properties met the requirements of high-power ceramic LED lamp holders. The Al2O3-10 wt%AlN composites sintered at 1600 oC had a dense microstructure, tight bonding among grains, and few pores, whichexplained the excellent performance of the samples.

#AlN #Al2O3 ceramics #Pressureless sintering #Thermal conductivity #Microstructure

참고문헌 (19)

참고문헌 신청

G. Shi / 2015 / J. Alloy. Compd. 628:413~415

N.C. Fan / 2017 / Porous Al2O3 catalyst carrier by 3D additive manufacturing for syngas reforming / Journal of Ceramic Processing Research 18(9):676~682

H.S. Kim / 2010 / Ceram. Int. 36:2039~2045

C. Liu / 2017 / J. Am. Ceram. Soc. 100:3380~3384

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