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이 논문의 연구 히스토리 (4)
2022
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In the non-cyanide-based electroless Au plating solution using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent, analysis of each component constituting the plating solution is essential for the analysis of the reaction mechanism. And component analysis in the plating solution is important for monitoring component changes in the plating process and optimizing the management method.
Capillary Electrophoresis (CE) method is rapid, sensitive and quantitative and could be readily applied to analysis of Au<SUP>n+</SUP> ion, complexing agent and reducing agent in electroless Au plating solution.
In this study, the capillary electrophoresis method was used to analyze each component in the electroless Au plating solution in order to elucidate the complex bonding form and the plating mechanism of the non-cyanide-based electroless Au plating bath. The purpose of this study was to establish data for optimizing the monitoring and management method of plating solution components to improve the uniformity of precipitation and stability.
As a result, it was confirmed that the analysis of thiomalic acid as a complexing agent and Au<SUP>n+</SUP> ions and the analysis of aminoethanethiol as a reducing agent were possible by capillary electrophoresis. In the newly developed non-cyanide-based electroless Au plating solution, it was confirmed that Au<SUP>n+</SUP> ions exist in the form of Au<SUP>+</SUP> having a charge of +1, and that thiomalic acid and Au<SUP>+</SUP> are combined in a molar ratio of 2 : 1. In addition, it was confirmed that aminoethanethiol can form a complex by combining with Au<SUP>+</SUP> ions depending on conditions as well as acting as a reducing agent.
Capillary Electrophoresis (CE) method is rapid, sensitive and quantitative and could be readily applied to analysis of Au<SUP>n+</SUP> ion, complexing agent and reducing agent in electroless Au plating solution.
In this study, the capillary electrophoresis method was used to analyze each component in the electroless Au plating solution in order to elucidate the complex bonding form and the plating mechanism of the non-cyanide-based electroless Au plating bath. The purpose of this study was to establish data for optimizing the monitoring and management method of plating solution components to improve the uniformity of precipitation and stability.
As a result, it was confirmed that the analysis of thiomalic acid as a complexing agent and Au<SUP>n+</SUP> ions and the analysis of aminoethanethiol as a reducing agent were possible by capillary electrophoresis. In the newly developed non-cyanide-based electroless Au plating solution, it was confirmed that Au<SUP>n+</SUP> ions exist in the form of Au<SUP>+</SUP> having a charge of +1, and that thiomalic acid and Au<SUP>+</SUP> are combined in a molar ratio of 2 : 1. In addition, it was confirmed that aminoethanethiol can form a complex by combining with Au<SUP>+</SUP> ions depending on conditions as well as acting as a reducing agent.
목차
Abstract
1. 서론
2. 실험 방법
3. 결과 및 고찰
4. 결론
References
참고문헌 (41)
참고문헌 신청
J. W. Schulze, M.Datta, T. Osaka, Eds., Microelectronic packaging, CRC Press, FL, U.S.A. (2005).
J. Jasper, D. Shiels, Gold bumps off the danger list, European Semiconductor, 22 (2000) 86.
E. L. Wooten, K. M. Kissa, A. Y. Yan, E. J. Murphy, D. A. Lafaw, P. F. Hallemeier, D. Maack, D. V. Attanasio, D. J. Fritz, G. J. McBrien, D. E. Bossi, A review of lithium niobate modulators for fiber-optic communications systems, IEEE J. Sel. Top. Quantum Electron., 6 (2000) 69.
W. J. Daukler, D. J. Resnick, W. A. Johnson, A. W. Yanof, A new operating regime for electroplating the gold absorber on x-ray masks, Microelectron. Eng., 23 (1994) 235-238.
W. Chu, M. L. Schattenburg, H. I. Smith, Low-stress gold electroplating for X-ray masks, Microelectron. Eng., 17 (1992) 223-226.
J. Jasper, D. Shiels, Gold bumps off the danger list, European Semiconductor, 22 (2000) 86.
E. L. Wooten, K. M. Kissa, A. Y. Yan, E. J. Murphy, D. A. Lafaw, P. F. Hallemeier, D. Maack, D. V. Attanasio, D. J. Fritz, G. J. McBrien, D. E. Bossi, A review of lithium niobate modulators for fiber-optic communications systems, IEEE J. Sel. Top. Quantum Electron., 6 (2000) 69.
W. J. Daukler, D. J. Resnick, W. A. Johnson, A. W. Yanof, A new operating regime for electroplating the gold absorber on x-ray masks, Microelectron. Eng., 23 (1994) 235-238.
W. Chu, M. L. Schattenburg, H. I. Smith, Low-stress gold electroplating for X-ray masks, Microelectron. Eng., 17 (1992) 223-226.
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