메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
Yuanzheng Wu (Chosun University) Inhwa Han (Kwangju Women"s University) Byung-Geon Park (Kwangju Women"s University) Jishun Li (Shandong Academy of Sciences) Hetong Yang (Shandong Academy of Sciences) Hyun-Jae Shin (Chosun University)
저널정보
한국생물공학회 KSBB Journal KSBB Journal Vol.31 No.3 (Wn.158)
발행연도
2016.9
수록면
171 - 177 (7page)

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
The effects of medicinal mushroom (Sparassis crispa) powder supplementation on the rheological property of dough and the quality of bread were investigated. Naturally dried S. crispa powders (NDSCP) and freeze-dried ones (FDSCP) were prepared. Farinograph profiles of dough showed that mushroom powder addition at levels higher than 1% led to reduced dough stability suggested by decreased development time and increased weakness. The incorporation of S. crispa powders was significantly (p<0.05) lower compared to other mushrooms which might be attributed to its high content of beta-glucan. FDSCP was chosen over NDSCP because of its fragrant flavor which could be ascribed to the preservation of volatile polyphenol components. The quality of FDSCP bread was evaluated with respect to specific volume, texture, color, and organoleptic qualities. The specific volume of bread with S. crispa powder decreased compared to the control, while textural properties, such as hardness, chewiness, and gumminess, were enhanced. Sensory evaluation showed that 0.3% FDSCP incorporation presented the highest bread quality. With its daily consumption, S. crispa supplemented bread can provide consumers with multiple health benefits.

목차

Abstract
1. INTRODUCTION
2. MATERIALS AND METHODS
3. RESULTS AND DISCUSSION
4. CONCLUSION
REFERENCES

참고문헌 (34)

참고문헌 신청

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!

이 논문의 저자 정보

이 논문과 함께 이용한 논문

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2017-470-001334604