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논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2006.5
- 수록면
- 674 - 678 (5page)
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In this paper, DC magnetron sputter process for the deposition of conductive nickel coating on ultra-high aspect ratio(UHAR) micro probe pins for wafer inspection is described. Magnetron sputtering is the most widely used method for vacuum thin film deposition and serves over 90% of the market for sputter deposition. However, it has been known that it is hard to coat the UHAR micro structures because of its directional characteristics. Generally, UHAR coating results show lacks of uniformityand strength. In order to overcome these problems, it was suggested that the introduction of the tilting and rotating stage would likely make not only the uniformity and the strength of coating but also the easiness of post-soldering increase. Through various experiments and analyses, optimal coating conditions, such as a space between pins, a concentration of argon gas, a vacuum pressure and a current of DC targets could be obtained. Under optimal conditions, up to 1,200 probe pins with 150㎛ diameter, 7.3㎜ length can be cleaned and coated in about 20 minutes almost without any defect. Consequently, we proved that, compared with a wet coating, a dry coated probe pin will likely have a better performance, cost-effectiveness and yield.
목차
Abstract
1. 서론
2. 증착 시험
3. 결과 및 토의
4. 결론
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UCI(KEPA) : I410-ECN-0101-2009-552-016174449