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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2021.11
- 수록면
- 513 - 520 (8page)
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초록· 키워드
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To fabricate electrodes for use in fl exible electronic devices with improved resistance to the mechanical stresses induced byrepeated bending, we developed a highly fl exible and conductive composite comprised of Ti 3 C 2 -based MXene nanosheetsand Ag nanoparticles. Specifi cally, we synthesized Ti 3 C 2 -based MXene nanosheets and added them as a second fi ller to anAg dispersion to fabricate Ag?MXene composite paste. Although the synthesized MXene nanosheets are somewhat lesselectrically conductive than pure Ag nanoparticles, the conductivity of the pattern formed by printing this composite pastewas comparable to that of pure Ag nanoparticle-based electrode. Moreover, resistance in the resulting electrode remainedfairly constant despite repeated bending employing a curvature radius of 2 mm. We attribute this to the presence of theMXene nanosheets, whose homogeneously distributed hydroxyl or oxygen terminate surface functional groups preventedor delayed the propagation of cracks inside the printed pattern despite repeated bending.
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참고문헌 (27)
참고문헌 신청
Chang Hyun Lee / 2019 / Characterization of Copper Complex Paste: Manufacture of Thin Cu‑Seed Films on Alumina Substrates / Electronic Materials Letters 15(2):247~252
Choong-Jae Lee / 2019 / Effect of Sn‑Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder / Electronic Materials Letters 15(6):693~701
Sung Yoon Kim / 2020 / Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles / Electronic Materials Letters 16(3):293~298
Byung-Hyun Bae / 2021 / Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment / Electronic Materials Letters 17(2):157~163
Chun, K. Y. / 2010 / Highly conductive, printable and stretchable composite fi lms of carbon nanotubes and silver / Nat. Nanotechnol 5:853~857
Choong-Jae Lee / 2019 / Effect of Sn‑Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder / Electronic Materials Letters 15(6):693~701
Sung Yoon Kim / 2020 / Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles / Electronic Materials Letters 16(3):293~298
Byung-Hyun Bae / 2021 / Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment / Electronic Materials Letters 17(2):157~163
Chun, K. Y. / 2010 / Highly conductive, printable and stretchable composite fi lms of carbon nanotubes and silver / Nat. Nanotechnol 5:853~857
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