메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
김판욱
저널정보
대한공업교육학회 대한공업교육학회지 대한공업교육학회지 제15권 제2호
발행연도
1990.12
수록면
87 - 98 (12page)

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
Unemployment might be occurred not only by a shortage of jobs but also by a shortage of people with the skills they need to fill those jobs. In fact industries are always looking for the competent workers. The objective of the study is to suggest the new approach method for the curriculum development of the technical high school. Among the various job analysis method, the DACOM is highly efficient and recommendable, because the trade skills are relatively broad and most of them are well known. This method is a kind of brainstorming workshop between the 8-12 best experienced workers taking 2-3 days. As the result of this study a curriculum developing procedual model was suggested. The distintive feature of the model is to be constructed with two major activities. The forepart is consisted of several steptual job analysis activities to extract worker`s necessary competencies, the after part is main curriculum developing procedures based on module learning concept. Between these seperated activities the screening is needed to describe the learning objective. The screening mesh is framed with many facters such as learner`s entry behavior, community needs, school facilities, and teacher competencies. The key to the success of technical high school curriculum innovation is how to invite experienced workers of the industries for the DACOM workshop. The most decisive way is to persuade the managerial persons to allow the invited worker participate to workshop being free from work. Finally, some recommendations are suggested for the responsible authorities to change the curriculum structure from the subjects based to the competency based, and the learn material from the conventional textbook to module material including many kinds of audio visual materials to each competency modules.

목차

등록된 정보가 없습니다.

참고문헌 (0)

참고문헌 신청

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2020-374-001541761