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논문 기본 정보

자료유형
학술저널
저자정보
최우림 (서울과학기술대학교) 이종현 (서울과학기술대학교)
저널정보
대한용접·접합학회 대한용접·접합학회지 大韓熔接·接合學會誌 第36卷 第2號
발행연도
2018.4
수록면
7 - 13 (7page)

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초록· 키워드

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To develop a fast formation method of conductive films by liquid phase sintering using a normal reflow process, a composite ink was fabricated by mixing a commercial ink containing Ag particles of 60 nm size and Sn-58Bi nanoparticles of 40 nm average size. In addition, the composite ink was spin-coated and reflow soldered at the nanoscale, that is finally transformed into a conductive film. Although the sheet resistance in a film made of pure Ag nanoparticles was as high as 1.24 Ω/□ under the temperature profile with a peak temperature of 174 ℃, the sheet resistance values after the addition of 0.003 g flux and Sn-58Bi nanoparticles became considerably low. In special, the sheet resistance decreased to the minimum values of 0.18 Ω/□ when the added amount of Sn-58Bi was 12 wt.%. Ag particles in a microstructure in the composite films grew into outstandingly big grains through agglomeration among the Ag particles by melting and wetting of Sn-58Bi and connectivity between the grains was also considerably enhanced. Meanwhile, the amount of unreacted Sn- 58Bi nanoparticles between the agglomerated grains increase and contact property between the agglomerated grains decrease when the added amount exceeded 12 wt.%, which gradually increasing the resistance. Excessive flux addition of 0.006 g increased the sheet resistance.

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Abstract
1. 서론
2. 실험 방법
3. 실험 고찰
4. 결론
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