지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2013.5
- 수록면
- 91 - 95 (5page)
이용수
초록· 키워드
오류제보하기
POP(Package on Package) technology that conoposed total module with making memory and logic to package through vertical stacking is taken notice to core of package technology because of anticipating high degree of accumulation. but because in-out put’s interval and chip’s thickness must be minimum, so heat generation is inflence on chip’s efficiency. therefore in this experiment, temperature of heat generation effected heat sink or solder ball is analized and compared through interpretarion of FVM(Finite Volume Method) for enhancing heat transferation. Putting heat sink on POP, heat generation temperature of die decreased 6℃ average. And putting solder ball or heat sink between top package and bottom package, heat of top package is tranfered to bottom package and ambient fluid, degree of die decreased 10℃ with putting solder ball and 12℃ with putting heat sink. and die of bottom package is expected to receive minuscule affection of heat sink or solder ball
목차
1. 서론
2. POP (Package on Package)
3. 수치해석
4. 해석결과
5. 결론
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UCI(KEPA) : I410-ECN-0101-2014-420-002915292