지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
이용수
초록· 키워드
오류제보하기
Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition.
Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.
Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.
목차
ABSTRACT
1. 서론
2. 기본 원리
3. 실험장치 및 조건
4. 실험결과 및 고찰
5. 결론
후기
참고문헌
참고문헌 (11)
참고문헌 신청
1. [단행본] - Doi, T / 2001 / CMP Technology for Semiconductor Planarization / Books-Hill
2. [학술지(정기간행물)] - Hahn, P / 2001 / The 300mm silicon wafer - a cost and technology challenge / Microelectronic Engineering 56 : 3 ~ 13
4. [학술지(정기간행물)] - Kim, H. Y / 2000 / Development of an Abrasive Embedded Pad for Dishing Reduction and Uniformity Enhancement / Journal of the Korean Physical Society 37 (6) : 945 ~ 951
5. [학술대회논문] - Won, J.K / 2006 / The study on the optimum Machining characteristic of 12 inch wafer polishing / Proceesdings of the KSME 2006 Spring Annual Meeting : 282 ~
6. [학술지(정기간행물)] - Z.J. Pei / 2002 / A study on surface grinding of 300mm silicon wafers / International Journal of Machine Tools & Manufacture 42 : 385 ~ 393
2. [학술지(정기간행물)] - Hahn, P / 2001 / The 300mm silicon wafer - a cost and technology challenge / Microelectronic Engineering 56 : 3 ~ 13
4. [학술지(정기간행물)] - Kim, H. Y / 2000 / Development of an Abrasive Embedded Pad for Dishing Reduction and Uniformity Enhancement / Journal of the Korean Physical Society 37 (6) : 945 ~ 951
5. [학술대회논문] - Won, J.K / 2006 / The study on the optimum Machining characteristic of 12 inch wafer polishing / Proceesdings of the KSME 2006 Spring Annual Meeting : 282 ~
6. [학술지(정기간행물)] - Z.J. Pei / 2002 / A study on surface grinding of 300mm silicon wafers / International Journal of Machine Tools & Manufacture 42 : 385 ~ 393
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UCI(KEPA) : I410-ECN-0101-2013-581-001476683