메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
저널정보
대한기계학회 Journal of Mechanical Science and Technology Journal of Mechanical Science and Technology Vol.21 No.12
발행연도
2007.12
수록면
2,041 - 2,047 (7page)

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
A material mixing method was suggested to obtain an optimal topology for a multiple material structure with multiple thermal criteria, based on Evolutionary Structural Optimization (ESO). To examine the validity of the method, it was applied to a printed circuit board (PCB) substrate. The overall efficiency of material usage in a PCB substrate was measured in terms of the combination of thermal stress and heat flux density by using a combination strategy with weighting factors. A Pareto optimal topology solution having multiple thermal criteria was obtained. The effects of weighting factors for multiple thermal criteria as well as mechanical boundary conditions on optimal topologies were investigated. It was found that as the weighting factor for heat flux density becomes larger, the sizes of holes at the center portion become larger in order to dissipate thermal energy much more efficiently. It was also found that as the magnitudes of the heat conduction are getting larger, a similar tendency of the optimal topologies is obtained to the above. The thermal stress on the clamped four sides is larger than that on the two sides clamped. It is verified that the suggested material mixing method works very well for topology optimization of a PCB substrate for various mechanical boundary conditions with multiple thermal criteria.

목차

Abstract
1. Introduction
2. Multiple thermal criteria
3. Material mixing method
4. Topology optimization for a pcb substrate
5. Conclusions
Acknowledgments
References

참고문헌 (8)

참고문헌 신청

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!

이 논문의 저자 정보

이 논문과 함께 이용한 논문

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2009-550-016116329