지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학위논문
- 저자정보
- 지도교수
- 김정무
- 발행연도
- 2018
- 저작권
- 전북대학교 논문은 저작권에 의해 보호받습니다.
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초록· 키워드
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In this thesis, a bump forming method for flip chip bonding using ink-jet printing technology is proposed. A flip chip bonded transmission line using a bump formed by conductive ink containing silver nanoparticles was fabricated to verify the proposed method. The transmission line was designed for the frequency band from 300 kHz to 3 GHz based on the microstrip theory. The DC resistance of reference line and flip chip bonded line simulated using COMSOL Multiphysics were 2.898 Ω and 2.982 Ω, respectively. The RF characteristic of the microstrip line was simulated using Ansoft HFSS. The insertion loss of the microstrip line are 0.601 dB for reference line and 0.615 dB for flip chip bonded line at 3 GHz.
The size of fabricated lines is 35×8.64×0.5 mm3. The DC resistance of reference line and flip chip bonded line were measured 3.1 Ω and 3.2 Ω, respectively. As a result of the analysis, it was confirmed that the DC resistance of ink-jet printed bumps form 0.56 % of the total DC resistance. The difference of the measured insertion loss was 0.04 dB and the measured return loss was greater than 15 dB in the frequency range from 300 kHz to 3 GHz. Therefore, the ink-jet printed bumps hardly affected the electric characteristics of the transmission line. Consequentially, the flip chip bonding method using the inkjet printing technology has shown reliability of electrical connection and it is expected to be applied for the integration of the chip and the substrate in RF field and various research fields.
The size of fabricated lines is 35×8.64×0.5 mm3. The DC resistance of reference line and flip chip bonded line were measured 3.1 Ω and 3.2 Ω, respectively. As a result of the analysis, it was confirmed that the DC resistance of ink-jet printed bumps form 0.56 % of the total DC resistance. The difference of the measured insertion loss was 0.04 dB and the measured return loss was greater than 15 dB in the frequency range from 300 kHz to 3 GHz. Therefore, the ink-jet printed bumps hardly affected the electric characteristics of the transmission line. Consequentially, the flip chip bonding method using the inkjet printing technology has shown reliability of electrical connection and it is expected to be applied for the integration of the chip and the substrate in RF field and various research fields.
목차
제 1 장 서론 11.1 연구의 배경 11.2 연구 동향 41.3 연구의 동기 및 목적 161.4 논문의 구성 18제 2 장 전도체와 전송선 설계 192.1 설계 목표 192.2 상세 설계 202.2.1 전송선 설계 202.2.2 플립칩 본딩된 전송선 설계 232.3 시뮬레이션 252.3.1 직류 저항 시뮬레이션 252.3.2 RF 특성 시뮬레이션 26제 3 장 전도체와 전송선의 제작 283.1 공정 순서 283.2 공정 방법 303.2.1 잉크젯 인쇄 기술을 이용한 전도성 잉크 분사 실험 303.2.2 전도체 제작 과정 343.2.3 전송선 제작 과정 373.3 제작 결과 383.3.1 직류 저항 측정을 위한 전도체 383.3.2 RF 특성 측정을 위한 전송선 41제 4 장 전기적 특성 측정 424.1 직류 저항 측정 424.2 RF 특성 측정 44제 5 장 결론 47참고문헌 48
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