목차

목 차
List of Tables·································································· ⅲ
List of Figure Captions······················································· ⅳ
국문요약 ······································································· ⅵ
1. 서론 ·········································································· 1
2. 이론적 배경 ································································· 2
2.1. PCB(인쇄회로기판) ····················································· 2
2.1.1. PCB 종류와 특성 ···················································· 2
2.2. 비아 홀 ·································································· 4
2.2.1. 비아 홀의 역할 ······················································ 4
2.3. 전해 도금법 ····························································· 4
2.3.1. 전해 도금의 원리 ··················································· 4
2.3.2. Faraday의 법칙 ······················································ 7
2.3.3. 전착기구 ······························································ 9
2.4. 첨가제의 영향 ·························································· 14
3. 실험 방법 ····································································· 16
3.1. Galvanostat 측정 ························································ 16
3.2. 전해 Cu Via-Filling ····················································· 18
4. 실험 결과 및 고찰 ··························································· 19
4.1. CuSO4·5H2O와 H2SO4의 농도에 따른 potential 변화 ················· 19
4.2. Cl-과 PEG, Cl-과 SPS 첨가량에 따른 potential변화 ·················· 22
4.3. Cl-과 PEG 첨가 비율에 따른 Cu Via-Filling 현상 ····················· 25
4.4. Cl-과 SPS 첨가 비율에 따른 Cu Via-Filling 현상 ······················ 30
4.5. Cl-과 PEG, SPS 첨가 비율에 따른 Cu Via-Filling 현상 ················ 32
5. 결론············································································ 34
참고 문헌········································································ 35
Abstract·········································································· 37