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이민형 (한국산업기술대학교, 한국산업기술대학교 대학원)

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2014
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한국산업기술대학교 논문은 저작권에 의해 보호받습니다.

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이 논문의 연구 히스토리 (2)

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본 연구는 Via-Filling 전해도금 공정시 흐르는 전류에 의한 누적전류량 증가에 따라 발생하는 유기첨가제의 분해에 관하여 진행하였다. Via-Filling 공정시에는 비아 홀의 입구 막힘 없이 바닥부터 도금이 차오르는 bottom-up 충전이 중요하며, 이를 위하여 억제제(suppressor), 가속제(accelerator), 평활제(Leveler) 등을 이용한 도금 연구가 활발히 진행되고 있다.
본 연구에서는 억제제로 PEG(Polyethylene glycol), 가속제로는 SPS (bis-3-sulfopropyl-disulfide), 평활제로는 JGB(Janus Green B)를 사용하였다. 우선, 첨가제 농도에 따른 bottom-up 특성변화를 정전류법(Galvanostat method)으로 관찰한 결과, PEG는 도금의 억제효과를 갖고 있으며, SPS는 도금의 가속효과를, JGB는 도금의 억제효과를 갖고 있음을 알 수 있었다. 또한, 각 유기물첨가제들은 특정 농도에서 bottom-up 특성이 극대화되며, 이는 첨가제간의 상호작용 및 Cl 이온과의 상관관계에 관련된 것을 알 수 있다.
누적전류량(Ah) 증가에 따른 유기물 첨가제들의 bottom-up 특성 변화 실험에서는 일정 누적전류량 이상에서 각 유기물 첨가제들의 분해가 발생하며, 분해가 발생하면 bottom-up 특성이 약화되는 것을 알 수 있었다. 또한, 첨가제의 분해되는 성향 및 시기는 각 첨가제마다 다른 것도 알 수 있다. 마지막으로 위 실험의 결과를 형상적으로 확인하기 위하여 Via-Filling 전해 도금 공정을 거친 후 단면 분석(Cross-section)을 한 결과, 유기물첨가제들의 분해 후 bottom-up 특성이 약화되는 것을 확인하였다.

목차

목 차
표 목 차 ········································································· ⅲ
그림목차 ······································································· ⅳ
국문요약 ······································································· ⅵ
1. 서론 ·········································································· 1
2. 이론적 배경 ································································· 3
2.1. 전해도금법 ····························································· 3
2.1.1. 전해도금의 개요 ······················································ 3 2.1.2. 전해도금의 원리 ···················································· 3
2.1.3. Faraday의 법칙 ···················································· 6
2.1.4. 전해도금층의 특성변화 요소 ······································· 8 2.1.5. 물질 이동과정(Mass- Transfer reaction) ························· 8
2.2. 유기첨가제(Organic Additive) ······································ 12
2.2.1. 억제제(Suppressor) ················································ 12 2.2.2. 가속제(Accelerator) ················································· 13
2.2.3. 평활제(Leveler) ···················································· 14
2.3. Via-Filling ······························································ 15
3. 실험 방법 ····································································· 19
3.1. 첨가제 농도에 따른 bottom-up 특성 변화 ························· 19 3.2. 누적 전류량(Ah)에 따른 bottom-up 특성 변화 ·················· 22
4. 실험 결과 및 고찰 ··························································· 23
4.1. 첨가제 농도에 따른 Potential 변화 ·································· 23
4.1.1. 황산구리 농도에 따른 Potential 변화 ··························· 23
4.1.2. PEG 농도에 따른 Potential 변화 ······························· 23
4.1.3. SPS 농도에 따른 Potential 변화 ································· 26
4.1.4. JGB 농도에 따른 Potential 변화 ································· 26
4.2. 누적 전류량(Ah)에 따른 Potential 변화 ···························· 29
4.2.1. 누적전류량 증가에 따른 PEG 특성 변화 ······················· 29
4.2.2. 누적전류량 증가에 따른 SPS 특성 변화 ························ 32
4.2.3. 누적전류량 증가에 따른 JGB 특성 변화 ························ 32
4.3. 첨가제 분해에 따른 Via-Filling 차이 ································ 35
4.3.1. PEG ·································································· 35
4.3.2. SPS ·································································· 35
4.3.3. JGB ·································································· 38
4.3.4. Via-Filling ·························································· 38
5. 결론············································································ 41
참고 문헌········································································ 43
Abstract·········································································· 45

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