지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학위논문
- 저자정보
- 지도교수
- 문철희
- 발행연도
- 2013
- 저작권
- 호서대학교 논문은 저작권에 의해 보호받습니다.
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Thermal characteristics of high-power multi-chip LED package were investigated. We prepared 5 kinds of LED packages with different substrate size, chip to chip pitch and number of chips. Thermal resistance of packages was measured by thermal transient analysis. The results showed that thermal resistance increased for smaller substrate size and chip to chip pitch.
Ambient temperature(TA) of LED package was changed as 25℃, 50℃ and 75℃ using Peltier element. Junction temperature(TJ) and thermal resistance were measured by thermal transient method using thermal resistance measurement system. At the same time, a heat transfer model was proposed to calculate the junction temperature and to investigate the heat transfer characteristics of the LED package. The results showed that TJ increased in proportion to TA, which was explained using the heat transfer model and I-V characteristics of the LED chip.
Junction temperature is a critical factor which determines the reliability of LED package, but it is difficult to evaluate TJ. To investigate the heat dissipation characteristics including TJ, we prepared three kinds of LED packages with different mold thickness, 0.7, 1.5 and 3.1 mm. The mold surface temperature (TM) was measured by thermo-couple. The junction temperature measured by measurement of TM successfully.
Ambient temperature(TA) of LED package was changed as 25℃, 50℃ and 75℃ using Peltier element. Junction temperature(TJ) and thermal resistance were measured by thermal transient method using thermal resistance measurement system. At the same time, a heat transfer model was proposed to calculate the junction temperature and to investigate the heat transfer characteristics of the LED package. The results showed that TJ increased in proportion to TA, which was explained using the heat transfer model and I-V characteristics of the LED chip.
Junction temperature is a critical factor which determines the reliability of LED package, but it is difficult to evaluate TJ. To investigate the heat dissipation characteristics including TJ, we prepared three kinds of LED packages with different mold thickness, 0.7, 1.5 and 3.1 mm. The mold surface temperature (TM) was measured by thermo-couple. The junction temperature measured by measurement of TM successfully.
목차
Ⅰ. 서 론 11. 연구의 배경 및 목적 12. LED 방열 특성 연구 10Ⅱ. LED 패키지 제작 방법 141. Die attach 142. Wire bonding 153. 봉지 (molding) 15Ⅲ. LED 패키지의 방열 특성 측정 방법 171. 접합 온도 측정 172. 열저항 측정 22Ⅳ. 고출력 멀티칩 LED 패키지에서의 방열 특성 변화 231. 패키지 제작 232. 고출력 멀티칩 LED 패키지에서의 방열 특성 26Ⅴ. 주변 온도에 따른 LED 패키지의 열 특성 변화 351. 패키지 제작 및 측정 방법 332. 주변 온도에 따른 LED 패키지의 열특성 35Ⅵ. 몰드 표면 온도 측정을 통한 접합 온도 예측법 431. 실험 설계 442. 몰드 표면 온도 측정을 통한 접합 온도 예측 46Ⅶ. 결 론 49참고문헌 51영문초록 55
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