지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학위논문
- 저자정보
- 발행연도
- 2013
- 저작권
- 부산대학교 논문은 저작권에 의해 보호받습니다.
이용수0
이 논문의 연구 히스토리 (2)
- 이 논문의 후속연구가 궁금하신가요?
- 연관 학술논문 또는 학술발표를 통해 보다 발전된 연구결과를 확인하실 수 있습니다.
- 이 논문의 연구 히스토리 확인하기
초록· 키워드
오류제보하기
An integrated stamp structure was suggested to optimize the fabricating process of a planar lightwave circuit device by imprinting. The suggested structure included the planar lightwave circuit device pattern and the inserting part of an optical fiber. The integrated stamp was fabricated by photo-lithography with the different depth on a single wafer. A nickel stamp was fabricated from the silicon stamp through the electro-forming process. The nickel stamp could improve the durability in the imprinting process.
The one step imprinting process was considered fabricating the planar lightwave circuit device and optical fiber inserting part. optimizing the imprinting factor ; imprinting pressure and time, the pattern which is able to interconnect with the 0.71~0.82% process error.
To solve the air bubble problem in the core resin while fabricating the planar lightwave circuit device in the imprinted pattern, the ultra sonic energy and vacuum chamber were used. For minimizing the residual layer of the core resin, 1.5MPa pressure was applied and 1um residual layer was obtained. This residual layer performed the adhesive of PMMA sheet and core resin, and no influence on the optical loss was found.
As the result of measuring the insertion loss of the fabricated planar lightwave circuit device, the insertion loss was 3.9dB, and 4.2dB, respectively. This fabricated planar lightwave circuit device through the imprinting process met the international standards and simplified the optical alignment and interconnection between the planar lightwave circuit device and the optical fiber.
The one step imprinting process was considered fabricating the planar lightwave circuit device and optical fiber inserting part. optimizing the imprinting factor ; imprinting pressure and time, the pattern which is able to interconnect with the 0.71~0.82% process error.
To solve the air bubble problem in the core resin while fabricating the planar lightwave circuit device in the imprinted pattern, the ultra sonic energy and vacuum chamber were used. For minimizing the residual layer of the core resin, 1.5MPa pressure was applied and 1um residual layer was obtained. This residual layer performed the adhesive of PMMA sheet and core resin, and no influence on the optical loss was found.
As the result of measuring the insertion loss of the fabricated planar lightwave circuit device, the insertion loss was 3.9dB, and 4.2dB, respectively. This fabricated planar lightwave circuit device through the imprinting process met the international standards and simplified the optical alignment and interconnection between the planar lightwave circuit device and the optical fiber.
목차
제 1 장 서론1.1 연구배경1.2 연구목적제 2 장 평면 광소자 및 광 정렬 구조 설계2.1 평면 광소자 설계2.1.1 평면 광도파로 이론2.1.2 유효 굴절률 법2.1.3 평면 광소자 1x2 splitter 구조 설계2.2 광 정렬 구조 설계 연구2.2.1 광 정렬 설계2.2.2 광소자 및 광섬유 정렬 구조2.3 요약제 3 장 평면 광소자 제작 공정 최적화 연구3.1 임프린트 기술3.2 임프린트용 스탬프 제작3.3 임프린트 공정 최적화 연구3.4 요약제 4 장 광 연결 구조 집적형 평면 광소자 개발4.1 집적형 스탬프 제작 연구4.2 이종 패턴 성형 최적화4.3 평면 광소자와 광섬유 간의 적층 기법 연구4.4 광 연결 구조 집적형 평면 광소자 특성 평가4.5 요약제 5 장 결론참고 문헌Abstract
최근 본 자료
댓글(0)
0