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논문 기본 정보

자료유형
학술저널
저자정보
최승우 (아주대학교) 도수윤 (아주대학교) 이정호 (아주대학교)
저널정보
한국유체기계학회 한국유체기계학회 논문집 한국유체기계학회 논문집 제28권 제2호(통권 제149호)
발행연도
2025.4
수록면
14 - 22 (9page)
DOI
10.5293/kfma.2025.28.2.014

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초록· 키워드

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With the advancement of microelectronic technology and the continuous improvement of device integration, microelectronic devices’ power density and heat generation have continuously increased. As microelectronic devices generate high heat flux exceeding 150 W/cm2, we need a more efficient solution for thermal management. Flow boiling is a proper solution due to the high heat transfer coefficient, less coolant flow rate, and uniform temperature distribution across the channel surface. However, the plain surface of minichannel has a small number of nucleation sites; surface modification can be a promising solution for enhancing boiling. Sintering, electric discharge machining (EDM), chemical etching, and coating have been investigated for surface modification, but these methods require considerable time, have a lot of costs, and have low productivity. Sandblasting, a method that sprays small abrasives under high-pressure air, is suitable for industrial applications because of its high productivity. Therefore, this study analyzed flow boiling heat transfer enhancement by applying sandblasting on the heat transfer surface. The experimental results showed that the onset of nucleate boiling is triggered at a smaller wall superheat, and the heat transfer coefficient is enhanced by 127%. Visualization analysis further confirmed that a sandblasted surface generates more nucleation sites, and the distribution of the nucleation sites is more uniform compared to a plain surface. Additionally, flow boiling heat transfer increased as the sandblasting abrasive became larger, using a 0.6 mm SUS cut-wire, which had the best heat transfer performance among all test conditions.

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ABSTRACT
1. 서론
2. 실험 시편 제작
3. 실험 장치 및 방법
4. 데이터 처리 및 불확도 분석
5. 실험 결과
6. 결론
References

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