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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2024.3
- 수록면
- 207 - 216 (10page)
- DOI
- https://doi.org/10.1007/s13391-023-00446-z
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초록· 키워드
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Eff orts to improve the properties of composites have involved extensive studies regarding the eff ective incorporationof a polymer matrix and inorganic fi llers. In this work, we generated a stable organosilica sol with high concentrationand high purity by surface modifi cation with silane coupling agents, then integrated it with an epoxy matrix. The silicananoparticle/epoxy composite exhibited improved tensile strength because of the uniform distribution of silica in the matrix,as well as the interfacial chemical bonding between polymer and silica nanoparticles; these factors resulted in eff ective loadtransfer from matrix to fi llers. Additionally, the application of copper-clad laminates (CCLs) with prepreg-containing silicananoparticles led to substantial improvements in mechanical properties, including peel strength (0.46 kgf/cm) and storagemodulus (30.0 GPa), compared with conventional CCLs lacking silica nanoparticles. These results suggest that prepregscontaining surface-modifi ed silica nanoparticles have great potential for use as printed circuit board substrate materials inhigh-performance electronics.
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