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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 한국전기전자재료학회 Transactions on Electrical and Electronic Materials Transactions on Electrical and Electronic Materials 제22권 제6호
- 발행연도
- 2021.12
- 수록면
- 809 - 820 (12page)
- DOI
- https://doi.org/10.1007/s42341-021-00303-6
이용수
초록· 키워드
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The output acoustic energy of a capacitive micromachined ultrasonic transducer (CMUT) can be enhanced by adjusting its membrane structure. In this paper three dissimilar membranes shapes of CMUT: circular, rectangular and hexagonal, were aimed and 3D finite element method simulated using adaptive meshing technique. The displacement as well as strain and stress outputs for a single membrane and an array of four membranes on a single substrate were obtained. The simulated results are supported by analytical modeling. A static bias of 40 V and a signal of amplitude 100 mV are employed. A pressure of 8603.98 N/m 2 resulting in a force of 16.894 μN was applied at the membrane. Fixtures were provided on every possible face of the structure except the face 1 (membrane). The outcomes showed that the membrane displacement is highest for a circular geometry under same uniform pressure and area of vibration. Moreover as the distance between the elemental membranes increases the displacement decreases for circular and hexagonal membranes while the reverse behavior is observed for rectangular membranes.
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참고문헌 (32)
참고문헌 신청
A. Emadi / 2016 / An air-coupled multiple moving membrane micromachined ultrasonic transducer with inverse biasing functionality / IEEE Trans. Ultrason. Ferroelectr. Freq. Control 63:1140
Q. Zhang / 2014 / Surfacemicromachined CMUT using low-temperature deposited silicon carbide membranes for above-IC integration / J. Microelectromech. Syst 23:482~493
G. Gurun / 2014 / Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging / IEEE Trans. Ultrason. Ferroelectr. Freq. Control 61:239
T. Emadi / 2015 / Design and characterization of a capacitive micromachined transducer with a defl ectable bottom electrode / IEEE Electron Device Lett 36:612
F. Y. Yamaner / 2015 / A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding / IEEE Trans. Ultrason. Ferroelectr. Freq. Control 62:972
Q. Zhang / 2014 / Surfacemicromachined CMUT using low-temperature deposited silicon carbide membranes for above-IC integration / J. Microelectromech. Syst 23:482~493
G. Gurun / 2014 / Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging / IEEE Trans. Ultrason. Ferroelectr. Freq. Control 61:239
T. Emadi / 2015 / Design and characterization of a capacitive micromachined transducer with a defl ectable bottom electrode / IEEE Electron Device Lett 36:612
F. Y. Yamaner / 2015 / A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding / IEEE Trans. Ultrason. Ferroelectr. Freq. Control 62:972
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