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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
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초록· 키워드
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The electroplating for copper foils has many advantages in economics. During the electroplating, the selection of appropriate additives is needed to manufacture copper foils with various properties. Therefore, it is investigated the initial plating voltage and the properties of copper foil electroplated in the electrolyte with benzothiazole as additives.
The addition of benzothiazole without any additives decreased effectively the initial plating voltage. However, the initial voltage increased when the additives was used in combination with an inhibitor and a leveler along with benzothiazole. Moreover, the voltage tends to increase with the concentration of benzothiazole except for 40 ppm group.
The mixed additives could change not only the initial voltage but also the morphology of crystals on the surface. When benzothiazole is added at 20 ppm or less, it was observed that the clustered crystals existed on the surface, which result in ununiform surface and high roughness value. In addition, the grain size increased with the amount of benzothiazole, but the resistivity decreased. However, when the leveler was added in 20 ppm, the grain size was decreased with the amount of benzothiazole. The size of the crystals could be influenced by the mixing ratio of additives. Therefore, it is necessary to study on the effect of concentration ratio of additives in the future.
The addition of benzothiazole without any additives decreased effectively the initial plating voltage. However, the initial voltage increased when the additives was used in combination with an inhibitor and a leveler along with benzothiazole. Moreover, the voltage tends to increase with the concentration of benzothiazole except for 40 ppm group.
The mixed additives could change not only the initial voltage but also the morphology of crystals on the surface. When benzothiazole is added at 20 ppm or less, it was observed that the clustered crystals existed on the surface, which result in ununiform surface and high roughness value. In addition, the grain size increased with the amount of benzothiazole, but the resistivity decreased. However, when the leveler was added in 20 ppm, the grain size was decreased with the amount of benzothiazole. The size of the crystals could be influenced by the mixing ratio of additives. Therefore, it is necessary to study on the effect of concentration ratio of additives in the future.
목차
Abstract
1. 서론
2. 실험방법
3. 결과 및 고찰
4. 결론
REFERENCES
참고문헌 (32)
참고문헌 신청
B. S. Min, W. S. Chung, I. G. Kim, Effect of frequency on properties of film in Cu electroplating using square pulse current, J. Kor. Inst. Met. & Mater., 40 (2002) 1281-1286.
S. H. Lee, N. J. Park, Effect of film thckness and annealing temperature on twin formation and annealing testure of Cu films, J. Kor. Inst. Met. & Mater., 45 (2007) 377-382.
M. H. Kim, H. R. Cha, C. S. Choi, J. M. Kim, D. Y. Lee, The influence of gelatin additives on the mechanical properties of electrodeposited Cu thin films, Korean. J. Met. Mater., 48 (2010) 884-892.
T. G. Woo, The effects of bis(3-Sulfo-Propyl)di-sulfide (SPS) additives on the surface morphology and mechanical properties of electrolytic copper foil, Korean. J. Met. Mater., 54 (2016) 681-687.
T. G. Woo, I. S. Park, Changes in electrical properties of copper-plated layer by organic additives on high current density, Korean. J. Met. Mater., 58 (2020) 41-48.
S. H. Lee, N. J. Park, Effect of film thckness and annealing temperature on twin formation and annealing testure of Cu films, J. Kor. Inst. Met. & Mater., 45 (2007) 377-382.
M. H. Kim, H. R. Cha, C. S. Choi, J. M. Kim, D. Y. Lee, The influence of gelatin additives on the mechanical properties of electrodeposited Cu thin films, Korean. J. Met. Mater., 48 (2010) 884-892.
T. G. Woo, The effects of bis(3-Sulfo-Propyl)di-sulfide (SPS) additives on the surface morphology and mechanical properties of electrolytic copper foil, Korean. J. Met. Mater., 54 (2016) 681-687.
T. G. Woo, I. S. Park, Changes in electrical properties of copper-plated layer by organic additives on high current density, Korean. J. Met. Mater., 58 (2020) 41-48.
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