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논문 기본 정보

자료유형
학술저널
저자정보
Hong Du (Shenzhen Water Group) Qi Shen (Harbin Institute of Technology) Pu Li (The University of HongKong) Dingyu Xing (Harbin Institute of Technology) Wenyi Dong (Harbin Institute of Technology) Zijun Dong (Shenzhen University) Feiyun Sun (Harbin Institute of Technology)
저널정보
대한환경공학회 Environmental Engineering Research Environmental Engineering Research 제28권 제3호
발행연도
2023.6
수록면
198 - 212 (15page)

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초록· 키워드

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With the rapid development of printed circuit board (PCB) industry, the problem of the release of tetrabromobisphenol A (TBBPA) during PCB manufacturing processes was recognized and harmful to the receiving water body. In this study, TBBPA generation paths, fates in industrial wastewater in the PCB manufacturing processes were analyzed. Gas chromatograph-mass spectrometer (GC-MS) scanning results showed that the raw materials including solder mask ink, character ink and dry film mainly contained TBBPA. The PCB fabrication procedures, mainly including development, etching, stripping of inner layer manufacturing process, and pattern plating, tin-plating of outer layer manufacturing process, and development during the forming and surface treatment process would introduce TBBPA into wastewater. Flocculation and activated sludge process (ASP) that were commonly used for industrial wastewater treatment were selected to assess their removal capability for TBBPA in the wastewater, both which could remove more than 80% TBBPA. Low pH below 7, increased PAC and PAM dosages, and proper dosing during the slow-stirring stage could enhance the TBBPA removal of flocculation-sedimentation process. The ASP removes TBBPA mainly by the path of adsorption. High activated sludge concentration, low pH, medium-temperature and limited competitive adsorbates (NH₄<SUP>+</SUP>, Cu<SUP>2+</SUP>) were beneficial to remove TBBPA by the ASP.

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ABSTRACT
1. Introduction
2. Materials and Methods
3. Results and Discussion
4. Conclusions
References

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