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논문 기본 정보

자료유형
학술대회자료
저자정보
Yeseul Son (Korea Electronics Technology Institute) Kwang-Soon Choi (Korea Electronics Technology Institute) Dohoon Kim (Korea Electronics Technology Institute)
저널정보
제어로봇시스템학회 제어로봇시스템학회 국제학술대회 논문집 ICCAS 2021
발행연도
2021.10
수록면
2,152 - 2,155 (4page)

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As a method to reduce the load on the CPU in AR glasses, where available resources are limited, research is being actively conducted on a method of additionally attaching a dedicated processor for a specific function. In order to display the augmented image on the augmented reality glasses, it is essential to understand the user"s location and surrounding environment, which is mainly calculated using the camera image. Image processing is the process that places the greatest burden on the CPU due to the large amount of data, and the Bundle Adjustment operation, which adjusts and updates the map, occupies the largest portion. Since it is difficult to perform in real time in an embedded environment, various methods have been tried. In this paper, we propose an FPGA-SoC structure that reduces CPU load by designing bundle adjustment operation as a HW module. The Bundle Adjustment module implemented in HW is implemented as a pipeline and parallel processing operation, and in addition, a memory structure is proposed for efficient data input and output of the module. The design is planned to be made with ASIC, and aims to be used as the co-processor of AR glasses.

목차

Abstract
1. INTRODUCTION
2. ALGORITHM
3. FPGA-SOC DESIGN
4. CONCLUSION AND FUTURE WORKS
REFERENCES

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