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Random defects occur on wafers or glasses during the fabrication of semiconductor. Defects larger than a certain critical size cause the immediate device failures and such defects are called the yield defects. Any device with a yield defect is scrapped or repaired. On the other hand, defects smaller than a critical size are released to the customer and may or may not cause the device failure depending on the operating time and the operating condition. It is necessary to develop the defect size distribution in the operating time and the operating condition. Previously, the defect size distribution at time is assumed to be a parallel move of the defect size distribution at time 0. In this paper, we consider a defect growth model using a lognormal distribution and develop expressions on semiconductor reliability for the different distributions for the number of random defects in a device. The proposed model has benefits over the previous model in that random exponential defect growth is considered.
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