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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
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A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.
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참고문헌 (14)
참고문헌 신청
R. Schwerz / 2013 / Proceeding of the Electronic Components and Technology Conference :1243
H. Azimi / Microelectronic packaging substrates: future challenges, The Intel Corporation On the Web
J. Fjelstad / 2013 / The PC design Magazine on HDI Technology
서정욱 / 2011 / 무전해 동도금 Throwing Power (TP) 및 두께 편차 개선 / 청정기술 17(2):103~109
X. Cui / 2012 / Thin Solid Films 520:6095
H. Azimi / Microelectronic packaging substrates: future challenges, The Intel Corporation On the Web
J. Fjelstad / 2013 / The PC design Magazine on HDI Technology
서정욱 / 2011 / 무전해 동도금 Throwing Power (TP) 및 두께 편차 개선 / 청정기술 17(2):103~109
X. Cui / 2012 / Thin Solid Films 520:6095
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