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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 대한전기학회 Journal of Electrical Engineering & Technology Journal of Electrical Engineering & Technology Vol.13 No.1
- 발행연도
- 2018.1
- 수록면
- 345 - 351 (7page)
이용수
초록· 키워드
오류제보하기
This paper analyzes a resonant inverter to generate plasma. The resonant inverter consists of a full bridge converter, resonant network and reactor to generate a magnetic field for plasma generation. A plasma load has very distinct characteristics compared to conventional loads. The characteristics of plasma load are analyzed through experimental results. This paper presents the study on the resonant network, which was performed in order to determine how to achieve a constant current gain. Another important contribution of this study is the analysis of drop-out phenomenon observed in plasma loads which is responsible for unpredictable shutdown of the plasma generator that requires stable operation. In addition, the design process for the resonant network of a plasma generator is proposed. The validity of this study is verified through simulations and experimental results.
목차
Abstract
1. Introduction
2. Electrical Characteristics of Plasma Load
3. Design and Control of Resonant Inverter for Reactive Gas Generator System
4. Simulations and Experimental Results
5. Conclusion
References
참고문헌 (8)
참고문헌 신청
S. S. Kim, D. K. Choi, “The development of RF generator for remote plasma cleaning source,” The 30th International Conference on Plasma Science, 2003. ICOPS 2003.
J. H. Lee, D. K. Choi, S. S. Kim, B. K. Lee, C. Y. Won “RF Power Conversional System for Environmentfriendly Ferrite Core Inductively Coupled Plasma Generator,” Journal of the Korean Institute of Illuminating and Electrical Installation Engineers, vol. 20, no. 8, pp. 6-14, Sep. 2006.
Ken Tran, Alan Millner, “A new power supply to ignite and sustain plasma in a reactive gas generator,” 2008 Twenty-Third Annual IEEE Applied Power Electronics Conference and Exposition, pp. 1885- 1892, 2008.
S. Raoux, J. G. Langan, “Remote NF3 Chamber Clean Virtually Eliminates PFC Emission from CVD Chamber and Improves System Productivity,” semiconductor fabtech-9th edition, pp. 107-113.
Y. K. Lee, D. S. Lee, K. H. Bai, C. W. Chung, H.Y. Chang, “On inductively coupled plasma for nextgeneration processing,” Surface and Coatings Technology, pp. 167-170, 2003.
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UCI(KEPA) : I410-ECN-0101-2018-560-001704798