지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 대한전자공학회 JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE Journal of Semiconductor Technology and Science Vol.12 No.3
- 발행연도
- 2012.9
- 수록면
- 320 - 330 (11page)
이용수
초록· 키워드
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In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.
목차
Abstract
Ⅰ. INTRODUCTION
Ⅱ. EQUIVALENT CIRCUIT MODEL FOR THE GRID STRCUTURE ON A PCB
Ⅲ. POWER INTEGRITY OF THE GRID STRUCTURE ON A PCB
Ⅳ. SHIELDING EFFECTIVENSS OF THE GRID STRUCTURE
Ⅴ. CONCLUSIONS
ACKNOWLEDGMENTS
REFERENCES
참고문헌 (23)
참고문헌 신청
1. [학술대회논문] - I. Novak / 1998 / Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination / Proc. 7th Topical Meeting Elect. Perform. Electron. Packag : 181 ~ 184
2. [학술지(정기간행물)] - J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam and J. Kim. / 2006 / Modeling and measurement of simultaneous switching noise coupling through signal via transition / IEEE TRANSACTIONS ON ADVANCED PACKAGING 29 (3) : 548 ~ 559
3. [학술지(정기간행물)] - K. Lee / 1995 / Modeling and analysis of multichip module power supply planes / IEEE Trans. Comp., Packag., Manufact. Technol. B 18 : 628 ~ 639
4. [학술대회논문] - Seong-Geun Park / 2003 / Multilayer Power Delivery Network Design for High-speed Microprocessor system / The 53rd Elect. Comp. and Technol. Conf., New Orleans, Louisiana, USA
5. [학술지(정기간행물)] - T. K. Wang / 2007 / Modeling noise coupling between package and PCB power/ground planes with an efficient 2D-FDTD/lumped element method / IEEE Trans. Adv. Packag 30 (4) : 864 ~ 871
2. [학술지(정기간행물)] - J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam and J. Kim. / 2006 / Modeling and measurement of simultaneous switching noise coupling through signal via transition / IEEE TRANSACTIONS ON ADVANCED PACKAGING 29 (3) : 548 ~ 559
3. [학술지(정기간행물)] - K. Lee / 1995 / Modeling and analysis of multichip module power supply planes / IEEE Trans. Comp., Packag., Manufact. Technol. B 18 : 628 ~ 639
4. [학술대회논문] - Seong-Geun Park / 2003 / Multilayer Power Delivery Network Design for High-speed Microprocessor system / The 53rd Elect. Comp. and Technol. Conf., New Orleans, Louisiana, USA
5. [학술지(정기간행물)] - T. K. Wang / 2007 / Modeling noise coupling between package and PCB power/ground planes with an efficient 2D-FDTD/lumped element method / IEEE Trans. Adv. Packag 30 (4) : 864 ~ 871
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