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We fabricated nano-particles of ZnO, In₂O₃ and SnO₂ by using the chemical reaction between metal thin films and polyamic acid. The average size and density of these ZnO, In₂O₃ and SnO₂ nano-particles was approximately 10, 7, and 15 nm, and 2×10¹¹, 6×10¹¹, 2.4×10¹¹ cm<SUP>-2</SUP>, respectively. Then, we fabricated nano-floating gate memory (NFGM) devices with ZnO and In₂O₃ nano-particles embedded in the devices' polyimide dielectrics and silicon dioxide layers as control and tunnel oxides, respectively. We measured the current-voltage characteristics, endurance properties and retention times of the memory devices using a semiconductor parameter analyzer. In the In₂O₃ NFGM, the threshold voltage shift (△V<SUB>T</SUB>) was approximately 5V at the initial state of programming and erasing operations. However, the memory window rapidly decreased after 1000 s from 5 to 1.5 V. The △V<SUB>T</SUB>> of the NFGM containing ZnO was approximately 2 V at the initial state, but the memory window decreased after 1000 s from 2 to 0.4 V. These results mean that metal-oxide nano-particles have feasibility to apply NFGM devices.

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Abstract
Ⅰ. INTRODUCTION
Ⅱ. EXPERIMENT
Ⅲ. RESULTS AND DISCUSSIONS
Ⅳ. CONCLUSIONS
ACKNOWLEDGMENTS
REFERENCES

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UCI(KEPA) : I410-ECN-0101-2010-569-001424670