메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
저널정보
한국자기학회 Journal of Magnetics Journal of Magnetics Vol.7 No.3
발행연도
2002.9
수록면
72 - 79 (8page)

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
Local M-H loops have been measured on the free layer of a tunneling magnetoresistance (TMR) junction using the magneto-optical Kerr effect (MOKE) system, with an optical beam size of about 2 ㎛ diameter. Tunnel junctions were deposited using the DC magnetron sputtering method in a chamber with a base pressure of 3 × 10^(-9) Torr. The relatively irregular variations of coercive force Hc (~17.5 Oe) and unidirectional anisotropy field Hua (~7.5 Oe) in the as-deposited sample are revealed. After 200 ℃ annealing, Hc decreases to 15 Oe but Hua increases to 20 Oe with smooth local variations. Two-dimensional plots of Hc and Hua show the symmetric saddle shapes with their axes aligned with the pinned layer, irrespective of the annealing field angle. This is thought to be caused by geometric effects during deposition, together with a minor annealing effect. In addition, the variation of root mean square (RMS) surface roughness reveals it to be symmetric with respect to the center of the pinned-layer axis, with the roughness of 2.5 Å near the edge and 5.8 Å at the junction center. Comparison of surface roughness with the variation of Hua suggests that the Hua variation of the free layer is well described by dipole interactions related to surface roughness. As a whole, the reversal magnetization is not uniform over the entire junction area and the macroscopic properties are governed by the average sum of local distributions.

목차

Abstract

1. Introduction

2. Experimental Procedure

3. Results and Discussion

4. Conclusion

Acknowledgements

References

참고문헌 (0)

참고문헌 신청

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!

이 논문의 저자 정보

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2009-428-015128762