지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
오류제보하기
The electric resistance and constant current were investigated on the nickel-thallium phosphorus alloy deposits by electroless-plating. The Ni-TI-P alloy deposits were achieved with a bath using sodium hypophosphit as the
reducing agent and sodium citrate as the comlexing agent. The basic plating solution is composed of 0.1M NiSO₄, 0.005~0.01M TI₂S0₄. 0.l~0.2M sodium hypophosphite and 0.02-0.1M sodium citrate and the plating condition were pH 5~6, temperrature 80~90℃. The results obtained are summarized as follows:
1) The crystal structure of deposit was amorphous structure as deposited state. became microcrystallized centering on Ni(111) plane by heat treatment at 200℃, and grew as polycrystalline Ni, Ni₃P, Ni5P2, TI, etc. by heat treatment higher than 350℃. The grain size of plated deposits was grown up to 28.3~42.0nm by heat treatment for 1 hour at 500℃. 2) The electrical resistivity showed a comparatively high value of 192.5~208.3Ωcm and its thermal stability was great with resistivity value less than 0.22% in the thermal surroundings of 200℃. 3) Ni-TI-P alloy deposit showed such good constant current-making- effect in the variation of electric voltage, heat treatment temperature, and the composition of the deposit that it can be put to practical use as the matter of constant current device.
reducing agent and sodium citrate as the comlexing agent. The basic plating solution is composed of 0.1M NiSO₄, 0.005~0.01M TI₂S0₄. 0.l~0.2M sodium hypophosphite and 0.02-0.1M sodium citrate and the plating condition were pH 5~6, temperrature 80~90℃. The results obtained are summarized as follows:
1) The crystal structure of deposit was amorphous structure as deposited state. became microcrystallized centering on Ni(111) plane by heat treatment at 200℃, and grew as polycrystalline Ni, Ni₃P, Ni5P2, TI, etc. by heat treatment higher than 350℃. The grain size of plated deposits was grown up to 28.3~42.0nm by heat treatment for 1 hour at 500℃. 2) The electrical resistivity showed a comparatively high value of 192.5~208.3Ωcm and its thermal stability was great with resistivity value less than 0.22% in the thermal surroundings of 200℃. 3) Ni-TI-P alloy deposit showed such good constant current-making- effect in the variation of electric voltage, heat treatment temperature, and the composition of the deposit that it can be put to practical use as the matter of constant current device.
목차
Abstract
Ⅰ. 서론
Ⅱ. 재료 및 방법
Ⅲ. 결과 및 고찰
Ⅳ. 결론
감사의 말씀
참고문헌
참고문헌 (0)
참고문헌 신청함께 읽어보면 좋을 논문
논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!
-
주조 형상기억 니켈-티타늄 합금의 초탄성
대한심미치과학회지
1995 .01
-
국산 Ni-Ti합금 교정용 선재의 특성에 관한 연구
대한치과교정학회지
1995 .04
-
어트리션 밀링법으로 제조된 티타늄합금의 상변화 및 미세조직특성
대한치과기공학회지
2001 .01
-
Nanotube Size Change of Dental Implant Alloys : CP-Ti, Ti-6Al-4V, Ti-Ta Alloy
대한치과재료학회 학술대회
2008 .05
-
The Effect of Silver Addition on the Surface characterization of Nickel Titanium Alloy
대한치과재료학회지
2010 .09
-
Hf가 첨가된 생체용 Ti-15Sn-4Nb 합금의 미세조직 및 내식성
대한치과기공학회지
2001 .01
-
생체용 타이타늄 합금의 산화거동 및 세포독성에 관한 연구
대한치과기공학회지
2004 .01
-
Bone and tissue reaction of porous nickel-titanium alloy implant for dental implants in rabbits
Oral Biology Research
2019 .01
-
TiN 코팅된 Ti 및 Ti-6Al-4V합금의 부식거동
대한치과기공학회지
2008 .01
-
Ti-Pd계 합금의 미세조직변화에 따른 부식거동
대한치과기공학회지
2008 .01
-
치과주조용 Ti-X%Cu(X=2,5,10)합금의 미세조직 및 경도
대한치과기공학회지
2009 .01
-
열간압연에 의한 Ti-Nb계 합금의 미세조직 및 내식성에 대한 연구
대한치과기공학회지
2002 .01
-
치과주조용 Ti-X%Zr(X=10,20,40)합금의 연삭성
대한치과기공학회지
2011 .01
-
Ti-Ni-Cu 납을 이용한 티타늄 납접부의 인장 및 피로강도
대한치과재료학회지
2001 .12
-
Nb 함량에 따른 Ti-Nb계 합금의 내식성에 대한 연구
대한치과기공학회지
2006 .01
-
인공치근용 cp-Ti에 첨가원소(Ta, Zr, Sn)가 기계적 특성 및 내식성에 미치는 영향
대한치과기공학회지
1999 .01
-
치과용 Ti-Xwt%Cu 합금의 연삭성
대한치과기공학회지
2009 .01
-
치과 교정용 심미 Ni-Ti 선재의 특성비교
대한치과재료학회 학술대회
2009 .11
-
열산화 처리된 Ti-Ag 합금의 세포적합성
대한치과보철학회지
2004 .01
-
Properties of experimental copperaluminium-nickel alloys for dental post-and-core applications
The Journal of Advanced of Prosthodontics
2014 .01
이 논문의 저자 정보
최근 본 자료
댓글(0)
0
UCI(KEPA) : I410-ECN-0101-2009-517-014302708