지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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- 자료유형
- 학위논문
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- 지도교수
- 김동권
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- 2018
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이 논문에서는 소형 전자부품 내 방열용으로 사용되는 판형-휜 히트 싱크의 부분적인 열원분포 상황에서 강제대류 하에서의 열성능에 관해 다룬다. 간단한 실험과 1차원 수치해석 두 가지 방법을 사용하여 판형-휜 히트 싱크의 열성능을 간단하게 예측할 수 있는 접근법을 제시하였다. 실험은 휜의 개수, 유량, 열원분포를 변화시키며 진행하였다. 수치해석은 열평형 방정식으로부터 유도한 1차원 모델을 이용하여 프로그래밍 언어 Python을 통해 수행하였다. 소형 전자부품은 평균온도 보다 국부 최고온도에 민감하기 때문에, 히트 싱크의 열성능을 판단하는 지표로써, 히트 싱크 최대 온도에 따른 열저항을 사용하였다. 실험 결과와 수치해석 결과로부터 도출한 히트 싱크의 최대 열저항은 열원 분포에 따라 최대 17%의 오차 이내에서 일치하였다. 수치해석 모델을 통하여, 일정 열량에서 열원의 위치와 분포에 따른 판형-휜 히트 싱크의 열성능의 경향을 파악하였다.
목차
목 차Page요 약 ······························································································································· ⅰ목 차 ·······························································································································ⅱList of Figures ············································································································ⅲList of Table ················································································································ⅴNomenclature ··············································································································ⅵ제 1 장 서론1.1 연구 배경·············································································································11.2 연구 동향 및 분석 ···························································································31.3 연구 목적·············································································································5제 2 장 실험 장치 및 방법2.1 실험 장치·············································································································62.2 실험 방법···········································································································122.2.1 본 실험····································································································122.2.2 열 손실 측정 실험················································································13제 3 장 해석 이론3.1 1차원 수치해석 모델링···················································································153.2 미정계수 설정···································································································18제 4 장 실험결과 및 고찰4.1 1차원 수치해석 모델을 통한 계산결과와 실험결과 비교·······················214.2 유량 변화에 따른 결과···················································································244.3 핀 간격에 따른 결과·······················································································274.4 열원위치와 분포에 따른 히트 싱크의 열저항 ···········································30제 5 장 결론 ··················································································································32참고문헌 ··························································································································33Appendix ························································································································34Abstract ··························································································································40
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