Recently, the continued growth in the solar industry has coincided with a fall in manufacturing costs. The highest price share in the solar industry is known as silicon and wafer currently. Therefore, thin crystalline silicon(c-Si) solar cell reducing the amount of silicon and wafer is one of the best ways to reduce costs. Numerous studies have been conducted on the thin c-Si solar cell, but studies on thin c-Si solar cell module have not been conducted much. Therefore, research for the manufacture of thin c-Si solar cell module should be conducted, and a new process should be applied, particularly considering the characteristics of thin c-Si solar cells. In this paper, we proposed a low-temperature tabbing method to reduce the damages by ‘bowing’ phenomenon caused by thermal expansion coefficients of between thin c-Si solar cell and ribbon. For the new tabbing process, we used conductive paste(CP). An environmental test(damp heat and thermal cycle) was performed to determine the efficiency and reliability of the fabricated modules. Samples are manufactured according to the lamination temperature conditions(120℃, 150℃, and 175℃). The initial output of the sample showed that the normal module and CP modules were almost identical, and the damp heat test results showed that the conventional module saw output decrease of 6% and the 120℃ module showed a 14% decrease in output, and showed a 3% reduction in output at 150℃ and 175℃ CP modules. The thermal cycle test results showed that the normal module showed a 1% decrease in output, 6% decrease at 120℃ CP module, and 150℃, 175℃ CP modules showed 2% and 3% reduction in output. Also, it conducted a 90° peel test to confirm the connection between the solar cell and the ribbon, and the test results showed that initial strength of the conventional module was 2.1N, and 1.7N after the test. In the case of CP modules, peel force of the 120℃ module appeared 1.7N in the initial and 0.9N after damp heat test, and the 150℃, 175℃ modules were shown in the initial 2.7N, and 2.0N after the test. Thus, the tests showed that the efficiency and reliability of CP modules was almost equal to the conventional module, and it was revealed that the proper temperature conditions for ensuring reliability were 150℃. Also, the possibility of producing the CP based low-temperature tabbing process was confirmed.