지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학위논문
- 저자정보
- 지도교수
- 최경현
- 발행연도
- 2015
- 저작권
- 제주대학교 논문은 저작권에 의해 보호받습니다.
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이 논문의 연구 히스토리 (3)
2017
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초록· 키워드
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In this study we introduced new technology and system of electro hydro
dynamic printing to make direct patterning for printed electronics. Electro
hydro dynamic printing technology is suggested for electrode pattern less
than 5um and repair process of shorted electrode pattern due to
miniaturization, light weight, integration of electronics devices by rapid
emerging printed electronics industry. Electro hydro dynamic printing
technology overcame several fatal disadvantages of traditional inkjet printing
technology. Traditional photo-lithography process of MEMS process is capable
of precise micro pattern but, has several disadvantages such like high cost,
environmental problems caused by harmful chemicals, waste materials. It has
limitation to use photo-lithography for fabrication of electronics devices by
efficient cost, environmental-friendly process.
Various printing process is applied to overcome photo-lithography’s
disadvantages by developing flexible electronics. ink jet printing technology of
non-contact printing process is capable of direct patterning without substrate
damage and recently a lot of research work has been going on. It is difficult
to apply for fabrication of electronic devices deu to limitation of micro pattern
less than 10um, viscosity more than 50cps.
we developed integration control software that is capable of control of
patterning head and patterning system for implementation 5um electrode
pattern by using electro hydro dynamic printing process. we did experiment
of electrode patterning according to applied voltage and material supply
pressure and implemented 5um electrode pattern with ±0.194 of standard
deviation by using electro hydro dynamic printing process.
dynamic printing to make direct patterning for printed electronics. Electro
hydro dynamic printing technology is suggested for electrode pattern less
than 5um and repair process of shorted electrode pattern due to
miniaturization, light weight, integration of electronics devices by rapid
emerging printed electronics industry. Electro hydro dynamic printing
technology overcame several fatal disadvantages of traditional inkjet printing
technology. Traditional photo-lithography process of MEMS process is capable
of precise micro pattern but, has several disadvantages such like high cost,
environmental problems caused by harmful chemicals, waste materials. It has
limitation to use photo-lithography for fabrication of electronics devices by
efficient cost, environmental-friendly process.
Various printing process is applied to overcome photo-lithography’s
disadvantages by developing flexible electronics. ink jet printing technology of
non-contact printing process is capable of direct patterning without substrate
damage and recently a lot of research work has been going on. It is difficult
to apply for fabrication of electronic devices deu to limitation of micro pattern
less than 10um, viscosity more than 50cps.
we developed integration control software that is capable of control of
patterning head and patterning system for implementation 5um electrode
pattern by using electro hydro dynamic printing process. we did experiment
of electrode patterning according to applied voltage and material supply
pressure and implemented 5um electrode pattern with ±0.194 of standard
deviation by using electro hydro dynamic printing process.
목차
Ⅰ. 서 론 5Ⅱ. 전기수력학적 프린팅 기술 91. 전기수력학적 프린팅 공정원리 101) 메니스커스 형성 및 토출 원리 102) 전기수력학적 프린팅 모드 제어 12Ⅲ. 전기수력학적 프린팅 시스템 151. 미세전극 패터닝용 전기수력학적 프린팅 헤드 개발 152. 전기수력학적 프린팅 공정 시스템 개발 181) 전기수력학적 프린팅 공정 테스트 베드 및 이송부 개발 192) 미세전극 패터닝용 고전압 공급 시스템 203) 전자식 정밀 공압 잉크 제어 장치 개발 214) 실시간 모니터링 시스템 225) 통합 공정 제어 소프트웨어 개발 25Ⅳ. 미세전극 패터닝 공정 실험 및 결과 291. 공정변수에 따른 미세전극 패터닝 실험 301) 인가전압에 따른 미세전극 패턴 토출 실험 322) 공급압력에 따른 미세전극 패턴 토출 실험 353) 미세전극 패턴 결과 평가 362. 미세전극 리페어를 위한 미세선폭 구현 411) 리페어용 단선회로 기판 제작 412) 단선회로 기판에 대한 리페어 공정 실험 결과 42Ⅵ. 결 론 44참 고 문 헌 46
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