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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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논문 기본 정보
- 자료유형
- 학위논문
- 저자정보
- 발행연도
- 2015
- 저작권
- 부산대학교 논문은 저작권에 의해 보호받습니다.
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Pb-free solder has recently been used in electronics in efforts to meet
environmental regulations, and a number of Pb-free solder alloy choices
SnAgCu solder and SnCu solder.
The study presents the Characterization of the mechanical properties of
the Sn-based lead-free solder alloys: 96.5Sn-3.0Ag-0.5Cu (SAC305),
99.0Sn-0.3Ag-0.7Cu (SAC0307), and 99.3Sn-0.7Cu (Sn0.7Cu) at the solder
joint scale. The long-term of reliability of Sn-0.3wt%Ag-0.7wt%Cu solder
joints and Sn-0.7wt%Cu solder joints were evaluted and compared with
Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. A reflow soldering
process was utilized in the preparation of the test vehicles involving a
flexible printed circuit board (FPCB). A thermal shock test was conducted up to 1500cycles at temperatures ranging from -40℃ to 90℃, with a dwell
time of 10min at each temperature. The intermetalic compounds (IMCs) of
the solder joint interfaces were analyzed by scanning electron microscopy
(SEM) and energy dispersive X-ray spectroscopy (EDS).
The intermetallic compound layers grew after 0, 500, 1000 and 1500
cycles. IMCs thickness was thicker SAC305 than SAC0307, Sn0.7Cu. but
IMCs growth speed make no difference. After 4-point bending test, Failure
time of SAC305 solder is longer than SAC0307, Sn0.7Cu. Crack propagtion
of three type solder all is same direction and fracture mode.
environmental regulations, and a number of Pb-free solder alloy choices
SnAgCu solder and SnCu solder.
The study presents the Characterization of the mechanical properties of
the Sn-based lead-free solder alloys: 96.5Sn-3.0Ag-0.5Cu (SAC305),
99.0Sn-0.3Ag-0.7Cu (SAC0307), and 99.3Sn-0.7Cu (Sn0.7Cu) at the solder
joint scale. The long-term of reliability of Sn-0.3wt%Ag-0.7wt%Cu solder
joints and Sn-0.7wt%Cu solder joints were evaluted and compared with
Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. A reflow soldering
process was utilized in the preparation of the test vehicles involving a
flexible printed circuit board (FPCB). A thermal shock test was conducted up to 1500cycles at temperatures ranging from -40℃ to 90℃, with a dwell
time of 10min at each temperature. The intermetalic compounds (IMCs) of
the solder joint interfaces were analyzed by scanning electron microscopy
(SEM) and energy dispersive X-ray spectroscopy (EDS).
The intermetallic compound layers grew after 0, 500, 1000 and 1500
cycles. IMCs thickness was thicker SAC305 than SAC0307, Sn0.7Cu. but
IMCs growth speed make no difference. After 4-point bending test, Failure
time of SAC305 solder is longer than SAC0307, Sn0.7Cu. Crack propagtion
of three type solder all is same direction and fracture mode.
목차
제 1 장 서 론 1제 2 장 이론적 배경 32.1 Flexible PCB 32.1.1 정의 32.1.2 연구 동향 42.2 무연 솔더 82.2.1 무연솔더 (Pb-free solder) 정의 82.2.2 도입 배경 82.2.3 무연솔더 종류 및 연구 동향 132.3 금속간화합물 (Intermetalic compound) 162.4 Rigid PCB에서 솔더 접합부 특성 21제 3 장 실험 방법 253.1 Pb-free solder 선정 253.2 시편 제작 273.3 열 충격 시험 (Thermal shock test) 343.4 4점 굽힙 시험 (4-point bending test) 373.5 금속간화합물 성장 및 파면 분석 43제 4 장 결과 및 고찰 444.1 열 충격에 의한 crack 발생 여부 444.2 열 충격에 따른 솔더 접합부 특성 504.2.1 금속간화합물 성장 504.2.2 금속간화합물층 두께 554.2.3 금속간화합물 형성에 필요한 활성화에너지 624.3 4점 굽힘 시험에 따른 솔더 접합부 특성 674.3.1 파단 시간 및 displacement 664.3.2 Dye-and-pry test 734.3.3 파면 관찰 및 분석 76제 5 장 결론 81참고문헌 84Abstract 86
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