지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학위논문
- 저자정보
- 지도교수
- 이득우
- 발행연도
- 2013
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- 부산대학교 논문은 저작권에 의해 보호받습니다.
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이 논문의 연구 히스토리 (4)
2013
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초록· 키워드
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Single crystal sapphire being used in high technology industry is a brittle material with a high hardness and excellent physical properties.
ELID(Electrolytic In-Process Dressing) grinding technology was applied to material removal machining process of single crystal sapphire wafer.
Ultrasonic vibration which added to material using ultrasonic table was adopted to efficient ELID grinding of sapphire materials. The evaluation of the ground surface of single crystal sapphire wafer was carried out by means of surface measuring by using AFM(Atomic force Microscope), surface roughness tester and optical microscope device. As the results of experiment, it was shown that more efficient grinding was conducted when using ultrasonic table. In case of using #170 grinding wheel, surface roughness of ELIDground specimen in using ultrasonic table was superior to ELID ground specimen without ultrasonic table. However, In case of using #2000 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was lower than ELID ground specimen without ultrasonic table.
ELID(Electrolytic In-Process Dressing) grinding technology was applied to material removal machining process of single crystal sapphire wafer.
Ultrasonic vibration which added to material using ultrasonic table was adopted to efficient ELID grinding of sapphire materials. The evaluation of the ground surface of single crystal sapphire wafer was carried out by means of surface measuring by using AFM(Atomic force Microscope), surface roughness tester and optical microscope device. As the results of experiment, it was shown that more efficient grinding was conducted when using ultrasonic table. In case of using #170 grinding wheel, surface roughness of ELIDground specimen in using ultrasonic table was superior to ELID ground specimen without ultrasonic table. However, In case of using #2000 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was lower than ELID ground specimen without ultrasonic table.
목차
1. 서론 12. 이론적 배경 42.1. ELID 연삭 가공 42.1.1. ELID 가공 메카니즘 42.1.2. ELID 가공 구성요소 72.2. 초음파 가공 103. 사파이어의 ELID 연삭 가공 123.1. 래핑 장치를 이용한 ELID 연삭 가공 123.1.1. ELID 가공 시스템 123.1.2. ELID 연삭 가공 방법 143.1.3. ELID 연삭 가공 결과 153.2. 평면 연삭기를 이용한 ELID 연삭 가공 183.2.1. ELID 가공 시스템 183.2.2. ELID 연삭 가공 및 결과 204. 진동을 이용한 ELID 연삭 가공 254.1. 초음파 진동 테이블 254.2. 초음파 진동을 이용한 ELID 연삭 가공 274.3. 패턴 특성 분석 354.3.1. 초음파 진동을 인가한 ELID 연삭 가공 354.3.2. 패턴 가공 결과 354.3.2. 마모 시험 435. 결론 47참고 문헌 50Abstract 51
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