지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2024.12
- 수록면
- 376 - 383 (8page)
- DOI
- 10.33162/JAR.2024.12.24.4.376
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초록· 키워드
오류제보하기
Purpose: This study aimed to enhance the reliability of bead-type negative temperature coefficient (NTC) thermistors by identifying failure mechanisms and developing improvement measures. Comparative life tests were conducted on thermistors before and after improvements to assess reliability improvements.
Methods: The relationship between temperature and resistance was evaluated using a temperature recorder and resistance meter. Failure analysis was conducted using field emission scanning electron microscopy (FE-SEM), X-ray, and optical microscopy. The findings revealed that thermal shock caused expansion and contraction of the internal thermal conductive epoxy, inducing mechanical stress on the thermistor component that led to fatigue failure. The primary failure mechanism was identified as grain boundary fractures, rather than intragranular fractures, caused by thermal shock, which resulted in gradual resistance increases.
Results: To mitigate thermal stress, an epoxy with a 57% lower thermal expansion coefficient was used. Comparative life testing confirmed a 64% increase in the relative lifespan of the improved samples, validating the hypothesized failure mechanism. The thermal stress from epoxy with a high thermal expansion coefficient was identified as the primary cause of failure of bead-type NTC thermistors under fluctuating temperature conditions.
Conclusion: Applying a thermally conductive epoxy with a thermal expansion coefficient closer to that of the thermistor effectively mitigated thermal stress, extending the device’s average lifespan. This adjustment shifted the failure mechanism to wear failure, significantly enhancing overall reliability.
Methods: The relationship between temperature and resistance was evaluated using a temperature recorder and resistance meter. Failure analysis was conducted using field emission scanning electron microscopy (FE-SEM), X-ray, and optical microscopy. The findings revealed that thermal shock caused expansion and contraction of the internal thermal conductive epoxy, inducing mechanical stress on the thermistor component that led to fatigue failure. The primary failure mechanism was identified as grain boundary fractures, rather than intragranular fractures, caused by thermal shock, which resulted in gradual resistance increases.
Results: To mitigate thermal stress, an epoxy with a 57% lower thermal expansion coefficient was used. Comparative life testing confirmed a 64% increase in the relative lifespan of the improved samples, validating the hypothesized failure mechanism. The thermal stress from epoxy with a high thermal expansion coefficient was identified as the primary cause of failure of bead-type NTC thermistors under fluctuating temperature conditions.
Conclusion: Applying a thermally conductive epoxy with a thermal expansion coefficient closer to that of the thermistor effectively mitigated thermal stress, extending the device’s average lifespan. This adjustment shifted the failure mechanism to wear failure, significantly enhancing overall reliability.
목차
1. 서론
2. 신뢰성 설계
3. 실험
4. 비교수명시험 결과
5. 결론
References
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