지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2024.12
- 수록면
- 368 - 375 (8page)
- DOI
- 10.33162/JAR.2024.12.24.4.368
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초록· 키워드
오류제보하기
Purpose: To identify the failure mechanism of mouse-bite defects and test a detection method that uses 4-wire resistance measurements at the location of the defect.
Methods: The failure of circuit boards due to mouse-bite defects was analyzed based on an electronic component failure analysis procedure. The hypothesis was then verified by finite element analysis and a reproducible reliability test. The normalized R, which normalizes the circuit resistance values to detect mouse-bite defects, was calculated and the probability distribution of the circuits was shown. The probability distribution including mouse-bite defects was visualized to distinguish the fault-free circuits from those above the 3-sigma upper limit.
Results: Failure mechanisms for mouse-bite defects can include increased resistance in localized areas of the circuit. This leads to Joule heating at the mouse-bite defects. Because of the mismatch in the coefficient of thermal expansion between the copper and dielectric materials, mechanical stress can be concentrated at these sites, leading to cracking. Mouse-bite defects were defined as those with a circuit width of 4 mm or less, and a circuit thickness of 7 mm or less, based on the failure analysis results. These defects were confirmed to cause open-circuit failures under use conditions. Successful detection of mouse-bite defects was confirmed based on a 3-sigma upper limit of the Normalized R metric.
Conclusion: By defining the failure mechanism of the mouse-bite defects, we confirmed the possibility of detecting these sites using a 3-sigma upper limit based on the Normalized R metric measured with a 4-wire ohmmeter.
Methods: The failure of circuit boards due to mouse-bite defects was analyzed based on an electronic component failure analysis procedure. The hypothesis was then verified by finite element analysis and a reproducible reliability test. The normalized R, which normalizes the circuit resistance values to detect mouse-bite defects, was calculated and the probability distribution of the circuits was shown. The probability distribution including mouse-bite defects was visualized to distinguish the fault-free circuits from those above the 3-sigma upper limit.
Results: Failure mechanisms for mouse-bite defects can include increased resistance in localized areas of the circuit. This leads to Joule heating at the mouse-bite defects. Because of the mismatch in the coefficient of thermal expansion between the copper and dielectric materials, mechanical stress can be concentrated at these sites, leading to cracking. Mouse-bite defects were defined as those with a circuit width of 4 mm or less, and a circuit thickness of 7 mm or less, based on the failure analysis results. These defects were confirmed to cause open-circuit failures under use conditions. Successful detection of mouse-bite defects was confirmed based on a 3-sigma upper limit of the Normalized R metric.
Conclusion: By defining the failure mechanism of the mouse-bite defects, we confirmed the possibility of detecting these sites using a 3-sigma upper limit based on the Normalized R metric measured with a 4-wire ohmmeter.
목차
1. 서론
2. 실험 방법
3. 결과 및 고찰
4. 결론
References
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