지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 한국고분자학회 폴리머 폴리머 제48권 제5호
- 발행연도
- 2024.9
- 수록면
- 485 - 493 (9page)
- DOI
- 10.7317/pk.2024.48.5.485
이용수
초록· 키워드
오류제보하기
Differential scanning calorimetry (DSC) and the Kissinger model-fitting showed that the peak curing temperatures of the four kinds of thermally conductive die attach adhesives ranged from 390 to 420 K, and they had high apparent activation energies and had obvious latent features as die attach adhesive at room temperature. T-β extrapolation method was used to determine the curing reaction conditions of the two-series adhesives as 110 ℃ × 1 h + 150 ℃ × 2 h and 120 ℃ × 1 h + 160 ℃ × 2 h, respectively. The basic performance, operation state, die shear test, and environmental reliability of the four kinds of thermally conductive die attach adhesives and the competitive sample S5 were characterized, the PSR-2 can achieve a good packaging effect at lower cost, and is expected to replace the current market mainstream thermally conductive die attach adhesive to reduce high-power lighting light emitting diode (LED) packaging cost.
목차
Abstract
Introduction
Experimental
Results and Discussion
Conclusions
References
참고문헌 (26)
참고문헌 신청
Wang, J.; Ma, H.; Ren, F.; Zhou, Z.; Xu, W. A Study on the Viscosity Reduction Mechanism of High-Filled Silicone Potting Adhesive by the Formation of Al2O3 Clusters. RSC Adv. 2022, 12, 10097-10104.
Shtein, M.; Nadiv, R.; Buzaglo, M.; Regev, O. Graphene-Based Hybrid Composites for Efficient Thermal Management of Electronic Devices. ACS Appl. Mater. Interfaces 2015, 7, 23725-23730.
Yang, X.; Liang, C.; Ma, T.; Guo, Y.; Kong, J.; Gu, J.; Chen, M.; Zhu, J. A Review on Thermally Conductive Polymeric Composites: Classification, Measurement, Model and Equations, Mechanism and Fabrication Methods. Adv. Compos. Hybrid. Mater. 2018, 1, 207-230.
Chang, M.-H.; Das, D.; Varde, P. V.; Pecht, M. Light Emitting Diodes Reliability Review. Microelectronics Reliab. 2012, 52, 762-782.
Liu, Z.; Liu, S.; Wang, K.; Luo, X. Status and Prospects for Phosphor-Based White LED Packaging. Front. Optoelectron. China 2009, 2, 119-140.
Shtein, M.; Nadiv, R.; Buzaglo, M.; Regev, O. Graphene-Based Hybrid Composites for Efficient Thermal Management of Electronic Devices. ACS Appl. Mater. Interfaces 2015, 7, 23725-23730.
Yang, X.; Liang, C.; Ma, T.; Guo, Y.; Kong, J.; Gu, J.; Chen, M.; Zhu, J. A Review on Thermally Conductive Polymeric Composites: Classification, Measurement, Model and Equations, Mechanism and Fabrication Methods. Adv. Compos. Hybrid. Mater. 2018, 1, 207-230.
Chang, M.-H.; Das, D.; Varde, P. V.; Pecht, M. Light Emitting Diodes Reliability Review. Microelectronics Reliab. 2012, 52, 762-782.
Liu, Z.; Liu, S.; Wang, K.; Luo, X. Status and Prospects for Phosphor-Based White LED Packaging. Front. Optoelectron. China 2009, 2, 119-140.
함께 읽어보면 좋을 논문
논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!
-
Thermal Property Measuring Instruments and Thermally Conductive Adhesives
한국고분자학회 학술대회 연구논문 초록집
2022 .04
-
Preparation of Thermally Processable and High Thermal Conductive Adhesive for Thermal Management Applications
한국고분자학회 학술대회 연구논문 초록집
2022 .10
-
Functional Adhesives: from Medical to Eco-friendly Adhesives
한국생물공학회 학술대회
2021 .10
-
Thermally conductive pressure sensitive adhesive composites using functionalized graphene oxides
한국고분자학회 학술대회 연구논문 초록집
2017 .04
-
Natural Adhesives from Agricultural By-products: A Review
한국농업기계학회 학술발표논문집
2017 .01
-
Study on Preparation of Thermal Conductive Pressure-Sensitive Adhesive with a Various Thermal Conductive Materials
한국고분자학회 학술대회 연구논문 초록집
2016 .10
-
A Study on Thermal Simulation for Adhesive Curing of Cylindrical Cigarettes
한국기계가공학회지
2021 .11
-
Adhesive Properties of the Acrylate Pressure Sensitive Adhesive with Various Types of Curing Agents
한국고분자학회 학술대회 연구논문 초록집
2016 .04
-
신축 가능한 에폭시 베이스 전도성 접착제 개발
마이크로전자 및 패키징학회지
2020 .01
-
Conductive and self-healed adhesive hydrogel by Fe3+-triggered co-polymerization of mussel adhesive protein and pyrrole
한국생물공학회 학술대회
2019 .10
-
Study on the Adhesive Strength by the Manufacturing Process Parameter of the Aluminum Pouch for Secondary Battery
Journal of the Korean Society for Precision Engineering
2016 .02
-
Mussel adhesive protein as an environmentally-friendly harmless Wood-based furniture adhesive
한국생물공학회 학술대회
2017 .04
-
Poly(acrylic acid)-based Tissue Adhesives with Enhanced Adhesive Properties
한국고분자학회 학술대회 연구논문 초록집
2024 .09
-
Characterization of Tissue-Adhesive Materials Using Biopolymers
한국고분자학회 학술대회 연구논문 초록집
2021 .10
-
알카리 실리케이트 기반 접착제의 경화 조건 조절을 통한 접착강도 향상 연구
대한기계학회 춘추학술대회
2018 .12
-
접착 기술 및 신뢰성 평가 가이드 개발 및 활용
한국신뢰성학회 학술대회논문집
2023 .06
-
다이접착필름의 조성물이 1단계 경화특성과 열기계적 물성에 미치는 영향에 관한 연구
한국산학기술학회 논문지
2020 .12
-
Tissue-adhesive Film Using Natural Macromolecules
한국고분자학회 학술대회 연구논문 초록집
2021 .04
-
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
[ETRI] ETRI Journal
2019 .12
-
구조용 접착제의 내충격성 향상을 위한 포뮬레이션 연구
대한용접학회 특별강연 및 학술발표대회 개요집
2023 .10
최근 본 자료
댓글(0)
0
UCI(KEPA) : I410-151-25-02-091190803