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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2023.5
- 수록면
- 1,342 - 1,348 (7page)
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초록· 키워드
오류제보하기
The increasing reliability requirements of power electronic components demands for a better understanding of their application-dependent aging progression. Active power cycling is a commonly used accelerated-aging method for invoking degradation effects in the thermal path of power devices. For aging diagnosis during power cycling, usually step-response thermal impedance spectroscopy is applied utilizing a temperature-sensitive parameter for thermal sensing. This approach has multiple limitations: Degradation detection close to the power semiconductor is limited since the load step over-proportionally excites low-frequency components. The temperature-sensitive parameter is by itself prone to aging, leading to reduced accuracy or necessitates repeated calibration. To overcome these limitations, this paper proposes online thermal impedance spectroscopy in frequency domain for aging diagnosis during active power cycling. By doing so, aging effects in the thermal path can be detected and localized more robustly and with higher accuracy without testing interruption. Furthermore, by using a near-chip NTC sensor for thermal sensing, calibration effort can be reduced significantly. This paper evaluates the online thermal impedance spectroscopy using data from the active power cycling of an IGBT lead-frame power module with a near-chip NTC.
목차
Abstract
I. INTRODUCTION
II. NEAR-CHIP NTC IN LEAD-FRAME MODULES
III. ONLINE THERMAL IMPEDANCE SPECTROSCOPY IN FREQUENCY DOMAIN
IV. DEGRADATION DIAGNOSIS DURING ACTIVE POWER CYCLING
V. CONCLUSION
REFERENCES
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