본 논문은 3D NAND Flash memory에서 tapering된 O/N/O(Oxide/Nitride/Oxide) 구조와 blocking oxide를 ferroelectric material로 대체한 O/N/F(Oxide/Nitride/Ferroelectric) 구조의 Vth(Threshold Voltage) 변화량을 분석했다. Tapering 각도가 0°일 때 O/N/F 구조는 O/N/O 구조보다 저항이 작고 WL(Word-Line) 상부와 WL 하부의 Vth 변화량이 감소한다. Tapering된 3D NAND Flash memory는 WL 상부에서 WL 하부로 내려갈수록 channel 면적이 감소하며 channel 저항이 증가한다. 따라서 tapering 각도가 증가할수록 WL 상부의 Vth가 감소하고 WL 하부의 Vth는 증가한다. Tapering된 O/N/F 구조는 channel 반지름 길이와 비례하는 Vfe로 인해 WL 상부의 Vth는 O/N/O 구조보다 더 감소한다. 또한 O/N/F 구조의 WL 하부는 O/N/O 구조보다 Vth가 증가하기 때문에 tapering 각도에 따른 Vth 변화량이 O/N/O 구조보다 더 증가한다.
This paper analyzed the Vth (Threshold Voltage) variations in 3D NAND Flash memory with tapered O/N/O (Oxide/Nitride/Oxide) structure and O/N/F (Oxide/Nitride/Ferroelectric) structure, where the blocking oxide is replaced by ferroelectric material. With a tapering angle of 0°, the O/N/F structure exhibits lower resistance compared to the O/N/O structure, resulting in reduced Vth variations in both the upper and lower regions of the WL (Word Line). Tapered 3D NAND Flash memory shows a decrease in channel area and an increase in channel resistance as it moves from the upper to the lower WL. Consequently, as the tapering angle increases, the Vth decreases in the upper WL and increases in the lower WL. The tapered O/N/F structure, influenced by Vfe proportional to the channel radius, leads to a greater reduction in Vth in the upper WL compared to the O/N/O structure. Additionally, the lower WL in the O/N/F structure experiences a greater increase in Vth compared to the O/N/O structure, resulting in larger Vth variations with increasing tapering angles.