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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2024.2
- 수록면
- 412 - 418 (7page)
- DOI
- 10.5370/KIEE.2024.73.2.412
이용수
이 논문의 연구 히스토리 (2)
2024
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초록· 키워드
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In this study, a numerical analysis model was developed for temperature distribution history analysis. To verify the numerical model, the temperature accumulation results analyzed through simulation were compared with the temperature accumulation results for each layer measured with an IR camera. Through temperature distribution history analysis using the commercial program vAMfire/Macro Ⓡ, the maximum height at which the maximum temperature is reached in each process according to the change in cross-sectional area was predicted. In addition, the temperature distribution history for each support was analyzed considering general support, wall support, and modified wall support to minimize heat dissipation and heat accumulation. The difference in heat dissipation effect depending on the type of support was quantitatively analyzed. By applying optimal support, we were able to solve the stacking problem caused by heat accumulation. Through heat transfer analysis, it was confirmed that quantitative analysis was possible to solve problems such as lamination failure and thermal deformation.
목차
Abstract
1. 서론
2. 본론
3. 결론
References
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