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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- Korean Society for Precision Engineering Journal of the Korean Society for Precision Engineering Journal of the Korean Society for Precision Engineering Vol.40 No.9
- 발행연도
- 2023.9
- 수록면
- 759 - 765 (7page)
- DOI
- 10.7736/JKSPE.023.069
이용수
초록· 키워드
오류제보하기
In-Mold Electronics (IME) is a manufacturing method that integrates printed decorations and electronic circuitry with thermoforming and injection molding processes. The method enables the production of ergonomic, lightweight and durable parts through cost-effective processes that require less assembly. Herein, the effect of circuit shape on line-width change by thermoforming was investigated through experiments and analysis based on the K-BKZ nonlinear viscoelastic model. Two circuit shapes, a horseshoe and a coil, were proposed and their line widths after thermoforming were measured and compared to that of a straight line shape. In the horseshoe-shaped circuit, the line width decreased as the radius increased due to the influence of vertical stretching caused by thermoforming. However, the effect of the angle on the line width was insignificant. In the coil-shaped circuit, the width of the line decreased as the pitch increased. However, as the amplitude increased, the line width also increased, but the effect was not significant. For the circuit shapes of the straight line, horseshoe and coil shapes, the rate of change in line width was 4.4, 0.4, and 0.2%, respectively. After conducting research, it was found that the coil-shaped circuit is more effective in minimizing line-width change caused by film thermoforming.
목차
1. 서론
2. 회로 형상 및 금형설계
3. 열성형 해석 및 실험
4. 회로 형상이 선폭에 미치는 영향
5. 결론
REFERENCES
참고문헌 (13)
참고문헌 신청
Neeli, M. R., (2015), An investigation into electronic circuit production in thermoplastics, Ph.D. Thesis, Griffith University.
Russo, A., Ahn, B. Y., Adams, J. J., Duoss, E. B., Bernhard, J. T., Lewis, J. A., (2011), Pen-on-paper flexible electronics, Advanced Materials, 23(30), 3426-3430.
Leong, Y., Yamaguchi, S., Mizoguchi, M., Hamada, H., Ishiaku, U., Tsujii, T., (2004), The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film/polypropylene matrix, Pol
Oulu, P. N., Kempele, J. S., Kempele, P. R., Oulu, M. H., Oulunsalo, M. S., Kempele, J. T., Oulu, A. K., (2017), Multilayer structure for accommodating electronics and related method of manufacture, US9724869.
Simula, T., Niskala, P., Heikkinen, M., Rusanen, O., (2018), Component packages for IMSE™ (Injection Molded Structural Electronics), Proceedings of the 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 50-54.
Russo, A., Ahn, B. Y., Adams, J. J., Duoss, E. B., Bernhard, J. T., Lewis, J. A., (2011), Pen-on-paper flexible electronics, Advanced Materials, 23(30), 3426-3430.
Leong, Y., Yamaguchi, S., Mizoguchi, M., Hamada, H., Ishiaku, U., Tsujii, T., (2004), The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film/polypropylene matrix, Pol
Oulu, P. N., Kempele, J. S., Kempele, P. R., Oulu, M. H., Oulunsalo, M. S., Kempele, J. T., Oulu, A. K., (2017), Multilayer structure for accommodating electronics and related method of manufacture, US9724869.
Simula, T., Niskala, P., Heikkinen, M., Rusanen, O., (2018), Component packages for IMSE™ (Injection Molded Structural Electronics), Proceedings of the 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 50-54.
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