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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2022.2
- 수록면
- 456 - 465 (10page)
- DOI
- 10.1007/s12540-021-01075-7
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초록· 키워드
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The maximum 320 K undercooling of Ni65Cu35 alloy was obtained by means of cyclic superheating in the state of moltenglass. The solidification structuresat different undercoolings were systematically studied. There are two grain refinementsatlow and high undercoolings. It was generally believed that the grain refinement atlowundercooling was caused by dendritesuperheat remelting. Electron backscattering diffraction was used to characterize the solidification structure athighundercooling,and obvious random orientation, high-angle grain boundaries and twin boundaries were found, indicating grainrefinement was caused by recrystallization under highundercooling. There were almost no visible dislocation defects in theTEM bright-field images at high undercooling, and the microstructure hardness decreased obviously after grain refinement.
This further illustrated the rapid accumulation of stress and defects in recalescenceare completely abreacted in recrystallizationduring post-recalescence period, at the same time as the driving force to promote the second grain refinement inthe microstructure.
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