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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2014.1
- 수록면
- 775 - 783 (9page)
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Selective deposition and formation of Ni-Cu-Sn electrodes by electroless plating using an all-wet processwere investigated to find a substitute for the commercial solar cells made by screen-printed Ag electrodes. Because of Ni-Cu-Sn multilayer, it is necessary to improve contact resistance at each interface usingannealing process. So Nickel silicide was created by controlling the Si and Ni interface for the formationof an ohmic contact to reduce the contact resistance and improve the efficiency of solar cells. The phasetransition and thermal stability of nickel silicide were analyzed in the annealing temperature range of 200-500 °C. Using electroless plated Ni, films with the thickness of 200±50 nm corresponding to the silicidephases of Ni2Si, Ni3Si2, and NiSi were identified from the thermal budget. The formation of the Ni74-Si26 silicide phase by rapid thermal processing at 250 °C was verified, and the possibility of low-temperatureNi silicidation was identified.
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참고문헌 (40)
참고문헌 신청
김동호 / 2013 / Investigation on Plated Ni/Cu Contact for Mono-Crystalline Silicon Solar Cells / Electronic Materials Letters 9(5):677~681
J. Bartsch. / 2010 / J. Electrochem. Soc. 157:H942
R. Hezel. / 1989 / J. Electrochem. Soc 136:518
P. Vitanov. / 1996 / Sol. Energ. Mat. Sol. C 44:471
J. A. Amick. / 1983 / J. Electrochem. Soc 130:160
J. Bartsch. / 2010 / J. Electrochem. Soc. 157:H942
R. Hezel. / 1989 / J. Electrochem. Soc 136:518
P. Vitanov. / 1996 / Sol. Energ. Mat. Sol. C 44:471
J. A. Amick. / 1983 / J. Electrochem. Soc 130:160
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