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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2012.1
- 수록면
- 349 - 354 (6page)
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초록· 키워드
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Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99K/mm) with a wide range of growth rates (8.3-478.6 µm/s) and at a constant growth rate (V=8.3 µm/s) with a wide range of temperature gradients (1.78-3.99 K/mm) using a Bridgman type directional solidification furnace. Wavelength-Dispersive X-ray Fluorescence spectrometry and X-ray diffraction were used to identify the compositions and phases in the microstructure. Dependence of eutectic spacings (λ) on the growth rate (V), temperature gradient (G) and cooling rate ( ) were determined using linear regression analysis. From the experimental results, it can be concluded that the values of λ decrease with the increasing the values of V, G and . The value of λ2V was determined using the measured values of λ and V. The results obtained in the present work have been compared with previous results obtained for binary or ternary alloys.
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