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논문 기본 정보

자료유형
학술저널
저자정보
Alkaios Bournias-Varotsis (Loughborough University) Shanda Wang (Loughborough University) David Hutt (Loughborough University) Daniel S. Engstrøm (Loughborough University)
저널정보
대한금속·재료학회 Electronic Materials Letters Electronic Materials Letters Vol.14 No.4
발행연도
2018.1
수록면
413 - 425 (13page)

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초록· 키워드

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Ultrasonic additive manufacturing (UAM) is a low temperature manufacturing method capable of embedding printed electronicsin metal components. The eff ect of UAM processing on the resistivity of conductive tracks printed with fi ve diff erentconductive pastes based on silver, copper or carbon fl akes/particles in either a thermoplastic or thermoset fi ller binder areinvestigated. For all but the carbon-based paste, the resistivity changed linearly with the UAM energy input. After UAMprocessing, a resistivity increase of more than 150 times was recorded for the copper based thermoset paste. The silver basedpastes showed a resistivity increase of between 1.1 and 50 times from their initial values. The carbon-based paste showedno change in resistivity after UAM processing. Focussed ion beam microstructure analysis of the printed conductive tracksbefore and after UAM processing showed that the silver particles and fl akes in at least one of the pastes partly dislodgedfrom their thermoset fi ller creating voids, thereby increasing the resistivity, whereas the silver fl akes in a thermoplastic fi llerdid not dislodge due to material fl ow of the polymer binder. The lowest resistivity (8 × 10 −5 Ω cm) after UAM processingwas achieved for a thermoplastic paste with silver fl akes at low UAM processing energy.

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