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자료유형
학술저널
저자정보
Jun‑Seok Nam (Chonbuk National University) Eonbyeong Park (Research Institute of Industrial Science and Technology) Jun‑Ho Seo (Chonbuk National University)
저널정보
대한금속·재료학회 Metals and Materials International Metals and Materials International Vol.26 No.4
발행연도
2020.1
수록면
491 - 500 (10page)

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In order to allow more practical prediction of RF (radio-frequency)–ICP (inductively coupled plasma) spheroidizationresults of titanium metal powder, numerical analyses under single particle and dense loading conditions were carried outand the results were compared. First, both of the numerical results for Ar inductively coupled plasma with the power levelof 30 kW revealed that the injected particles can experience not only spheroidization by melting, but also size reduction byevaporation. In addition, this size reduction was found to strongly depend on the initial sizes of the injected particles, due tothe relatively short heating time. For example, the 100 μm Ti particles were computed to hardly experience size reduction byevaporation regardless of feeding rates. However, relatively small Ti particles < 100 μm can be rapidly heated up to boilingpoints during the short flight of plasma, resulting in the size reduction by the surface evaporation. In particular, numericalresults under dense loading condition showed that the final sizes of these small Ti particles can be changed depending onthe feeding rate. For example, a single 60 μm Ti particle was calculated to be a 51 μm spherical Ti particle due to the excessiveheating. However, with the increase of feeding rate up to 1.0 kg/h, the final sizes of the as-treated Ti powder couldbe improved to 55 μm due to the plasma temperatures decreasing through complicated plasma–particle interactions. Bypredicting the relationships between the feeding rates and the initial diameters of Ti powders at a given plasma power level,numerical modellings under single particle and dense loading conditions can help in optimizing the RF–ICP spheroidizationprocess of titanium metal powder.

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